Abstract: A method for encapsulating a surface of an integrated circuit to protect the surface. The surface has an outer peripheral area and an inner area to be encapsulated. A frame is provided for handling an integrated circuit package. A plurality of leads are coupled between the frame and the outer peripheral area. An encapsulation material is dispensed on the outer peripheral area covering and protecting a portion of the leads and integrated circuit. A planar encapsulation material is deposited for covering and protecting the inner area. The planar encapsulation material provides a planar surface.

Abstract: Bond tool pressure distribution is optimized by a method and apparatus having a device having a first surface which permits inclination of the first surface in at least one direction, wherein the device is in a locked position. A first bonding arrangement is positioned on the first surface of the device. A second surface makes contact to the first bonding arrangement. This contact is detected and the device is unlocked to allow the first surface to incline while the second surface is in contact with the first bonding arrangement. The second surface is applied to the first bonding arrangement with a force, and the device is locked upon application of the force.

Abstract: A heating element is held in position by a rigid holder constructed to surround an ultrasonic bonding tool and is itself fastened in a fixed position relative to the bonding tool, such that the rigid holder and the heating element are held in close proximity to the bonding tool without physically contacting the bonding tool. This serves to heat the bonding tool, facilitating adequate bonding without overly heating the integrated circuit assembly and without interfering with the critical ultrasonic properties of the bonding tool and ultrasonic transducer horn.