Patents by Inventor Mark C. Huth

Mark C. Huth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7893386
    Abstract: The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: February 22, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Charles Otis, Mehrgan Khavari, Jeffrey R. Pollard, Mark C. Huth
  • Patent number: 6930055
    Abstract: The described embodiments relate to substrates having features formed therein and methods of forming same. One exemplary method forms a blind feature through a majority of a thickness of a substrate, the blind feature being defined by at least one sidewall surface and a bottom surface. The method also applies an etch resistant material to the blind feature and removes the etch resistant material from at least a portion of the bottom surface. The method further wet etches the substrate at least through the bottom surface sufficient to form a through feature through the thickness of the substrate.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: August 16, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhowmik, Rio T. Rivas, Mark C. Huth, Rocky H. Knuth
  • Publication number: 20030202046
    Abstract: The orifice plate has a central area with an orifice. The plate further has an edge area that surrounds the central area and is proximate to the edges of the orifice plate. The edge area has an aperture therein.
    Type: Application
    Filed: April 25, 2002
    Publication date: October 30, 2003
    Inventors: Smida Abdelli, Mark C. Huth, Rio Rivas
  • Publication number: 20030155328
    Abstract: The described embodiments relate to methods and systems for laser micromachining a substrate. One exemplary embodiment positions a substrate in an open air environment. The substrate has a thickness defined by opposing first and second surfaces. The substrate can be cut by directing a laser beam at the first surface of the substrate and introducing an assist gas proximate to a region of the substrate contacted by the laser beam.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Inventors: Mark C. Huth, Jeffrey R. Pollard, Graeme Scott
  • Patent number: 5917527
    Abstract: Disclosed is a novel inkjet print cartridge (pen) in which a body of polyurethane foam is inserted into an ink chamber of the pen for ink containment and backpressure. The ink chamber has a tall narrow aspect ratio. The body of polyurethane foam is felted in the width direction of the pen to have a width less than 20% of its pre-felted width. After felting, the body of foam is cut to have a "near net size" as the interior volume of the ink chamber. Specifically, the pre-insertion volume is less than about 130% of the interior volume of the ink chamber. The substantial felting in the width direction provides sufficient stiffness to the foam that it can be inserted into the tall, narrow aspect ratio ink chamber.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: June 29, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Patrick V. Boyd, Mark C. Huth, John M. Altendorf, Joseph R. Elliot