Abstract: The method is provided for fabricating an optical metasurface. The method may include depositing a conductive layer over a holographic region of a wafer and depositing a dielectric layer over the conducting layer. The method may also include patterning a hard mask on the dielectric layer. The method may further include etching the dielectric layer to form a plurality of dielectric pillars with a plurality of nano-scale gaps between the pillars.

Abstract: Subwavelength conducting particles can be arranged on conducting surfaces to provide arbitrary thermal emissivity spectra. For example, a thermal emissivity spectrum can be tailored to suppress a thermal signature of an object without sacrificing radiative cooling efficiency.

Abstract: Embodiments include a LIDAR scanning system. A laser is configured to emit pulses of light. A transmit reconfigurable-metasurface is configured to reflect an incident pulse of light as an illumination beam pointing at a field of view. This pointing is responsive to a first holographic beam steering pattern implemented in the transmit reconfigurable-metasurface. A receive reconfigurable-metasurface is configured to reflect a return of the illumination beam to an optical detector. This pointing is responsive to a second holographic beam steering pattern implemented in the receiving reconfigurable-metasurface. An optical detector includes an array of detector pixels. Each detector pixel includes (i) a photodetector configured to detect light in the return of the illumination beam and (ii) a timing circuit configured to determine a time of flight of the detected light. The optical detector is also configured to output a detection signal indicative of the detected light and the time of flight.

Abstract: A hologram system may include a hologram chip comprising a wafer substrate having a first plurality of conductive pads on a hologram surface region connected to a second plurality of conductive pads on an interconnect surface region. The hologram chip may also include an array of sub-wavelength hologram elements integrated with a refractive index tunable core material on the hologram region of the wafer substrate. The hologram system may also include a control circuit chip having a third plurality of conductive pads connected to the second plurality of conductive pads on the interconnect region of the wafer substrate. The interconnect region is on the same side of the wafer substrate as the hologram region. The first plurality of conductive pads is directly connected to the array of sub-wavelength hologram elements.

Abstract: A 2D hologram system with a matrix addressing scheme is provided. The system may include a 2D array of sub-wavelength hologram elements integrated with a refractive index tunable core material on a wafer substrate. The system may also include a matrix addressing scheme coupled to the 2D array of sub-wavelength hologram elements and configured to independently control each of the sub-wavelength hologram elements by applying a voltage.

Abstract: The method is provided for fabricating an optical metasurface. The method may include depositing a conductive layer over a holographic region of a wafer and depositing a dielectric layer over the conducting layer. The method may also include patterning a hard mask on the dielectric layer. The method may further include etching the dielectric layer to form a plurality of dielectric pillars with a plurality of nano-scale gaps between the pillars.