Abstract: A device for constraining liquid cooling tubes may include connecting a first tube connector and a second tube connector with a stretchable strip of flexible material. The first tube connector is configured to fluidly seal to a first end of a liquid cooling tube, and the second tube connector is configured to fluidly seal to a second end of the liquid cooling tube. The device may also include connecting the first tube connector to a first manifold and connecting the second tube connector to a second manifold when a computing device in a rack is in operation. The device may also include disconnecting the first tube connector to the first manifold and the second tube connector to the second manifold. The first tube connector and the second tube connector are constrained by the stretchable strip of flexible material when the computing device is moved out of the rack.

Abstract: The present technology is directed to constraining liquid cooling tubes. The present technology may include connecting a first tube connector and a second tube connector with a stretchable string of flexible material. The first tube connector is configured to fluidly seal to a first end of a liquid cooling tube, and the second tube connector is configured to fluidly seal to a second end of the liquid cooling tube. The present technology may also include connecting the first tube connector to a first manifold and connecting the second tube connector to a second manifold to extend the stretchable strip of flexible material when a computing device in a rack is in operation. The present technology may also include disconnecting the first tube connector to the first manifold and the second tube connector to the second manifold to prepare for the computing device to be serviced.

Abstract: A system may include a motherboard, a chipset coupled to the motherboard, a memory module mount coupled to the chipset, a power transistor electrically coupled to the memory module mount, a voltage regulator to provide power to the power transistor, and an I/O expander coupled to the motherboard. The I/O expander is to receive instructions from the chipset to selectively control the power transistor to provide the power to the memory module mount.

Abstract: A system may include a motherboard, a chipset coupled to the motherboard, a memory module mount coupled to the chipset, a power transistor electrically coupled to the memory module mount, a voltage regulator to provide power to the power transistor, and an I/O expander coupled to the motherboard. The I/O expander is to receive instructions from the chipset to selectively control the power transistor to provide the power to the memory module mount.