Patents by Inventor Mark D. Guzzi

Mark D. Guzzi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9442774
    Abstract: Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: September 13, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Sumit Sur, James M. Artmeier, Mark D. Guzzi, Philip T. Mueller, Jr., Bohuslav Rychlik
  • Patent number: 9442773
    Abstract: Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: September 13, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Sumit Sur, James M. Artmeier, Mark D. Guzzi, Philip T. Mueller, Jr., Bohuslav Rychlik
  • Publication number: 20140189710
    Abstract: Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
    Type: Application
    Filed: March 4, 2014
    Publication date: July 3, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Sumit SUR, James M. Artmeier, Mark D. Guzzi, Philip T. Mueller, Bohuslav Rychlik
  • Publication number: 20130132972
    Abstract: Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
    Type: Application
    Filed: January 25, 2012
    Publication date: May 23, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Sumit Sur, James M. Artmeier, Mark D. Guzzi, Philip T. Mueller, JR., Bohuslav Rychlik