Abstract: A three-way heat exchanger for a liquid desiccant air-conditioning system and method of manufacture. The heat exchanger includes a plurality of panel assemblies. Each panel assembly has a frame bordering a given space. The frame includes desiccant inlet and outlet ports and heat transfer fluid inlet and outlet ports. Two plates joined to the frame define a heat transfer fluid channel in the given space. The heat transfer fluid inlet and outlet ports are in fluid communication with the heat transfer fluid channel. Microporous sheets cover the outer surfaces of the plates and define a desiccant channel. The desiccant inlet and outlet ports are in fluid communication with the desiccant channel. The plurality of panel assemblies have a stacked arrangement such that a microporous sheet on one panel assembly faces a microporous sheet on an adjacent panel assembly and defines an airflow channel therebetween.

Abstract: A liquid desiccant air-conditioning system provides a uniform liquid desiccant flow distribution and wetting out of membranes used in the membrane-modules of the system.

Abstract: A three-way heat exchanger includes multiple panel assemblies that are stacked into a block and supported in a housing structure. Each panel assembly includes a frame and two plates joined on opposite sides of the frame. A method of manufacturing the three-way heat exchanger is also disclosed.

Abstract: Methods and control systems are disclosed for operating a liquid desiccant air-conditioning system to efficiently maintain a target temperature and humidity level in a space.

Abstract: A liquid desiccant air-conditioning system provides a uniform liquid desiccant flow distribution and wetting out of membranes used in the membrane-modules of the system.

Abstract: A method of manufacturing a heat exchanger, include the steps of: (a) providing two plates configured to be assembled together, each of the plates comprising a support layer and a cap layer laminated over the support layer at least at a front side of the plate; (b) heat bonding a microporous membrane layer to one or more select portions of the cap layer on the front side of each plate such that a liquid desiccant channel is formed between the membrane layer and the front side of each plate; and (c) attaching the front sides of the plates together to form a plate pair structure by heat bonding one or more select portions of the cap layers on the front sides of the plates such that the membrane layers on the plates face each other and an air flow channel is formed between the membrane layers.

Abstract: Apparatus for use in edge etching a plurality of flat semiconductor wafers comprises a carousel releasably holding a plurality of carriers that are adapted to support a horizontal stack of wafers at selected points along the edges of the wafers. The carousel is adapted to be releasably attached to a dual axis rotary drive mechanism in a reaction chamber containing a plasma jet stream generator. The drive mechanism is operated to cause axis rotation of the carriers over the plasma jet stream, with selected edges of the wafers being directly exposed to and etched by the plasma. The etching process is interrupted to permit the carriers to be removed from the carousel for reorientation of the wafers. Thereafter, the etching process is resumed, whereby other edges of the wafers are subjected to etching by the plasma jet stream.

Abstract: Apparatus for forming shallow p-n junctions in silicon substrates to produce photovoltaic cells, which apparatus provides three processing chambers. An ultrasonic spray is mounted in the first processing chamber to coat a front surface of the substrate with a liquid dopant-containing material. The second processing chamber dries the coated substrates leaving a dopant-containing residue on the front surface. The third processing chamber fires the substrates in an oxygen-containing environment to diffuse the dopant into the substrate and provide a p-n junction. The apparatus conducts humidified air to each chamber to control polymerization of the dopant source and to prevent non-humidified air from entering the chambers.

Abstract: Silicon solar cells are made by subjecting semiconductor substrates to a diffusion junction forming process wherein a liquid source material containing a selected dopant is sprayed onto one side of the substrates, and thereafter the substrates are fired in an oxygen-containing environment under conditions calculated to cause the dopant to diffuse into the substrates so as to form a shallow p-n junction in each substrate.