Abstract: A probe for use with circuitry for monitoring signals emanating from a heated electrical appliance, the probe including a planar member having three layers, the first layer including at least a first electrically conductive portion adapted to support a piece of solder, the second layer being an electrically insulating layer disposed between the first layer and a third layer, the third layer being electrically conductive. A novel method and circuit using the above probe are also disclosed wherein a heated soldering iron or solder extractor tip or the like melts the piece of solder to establish good electrical connection for the signals from the tip to the monitor circuit through the molten solder and the first portion of the first layer.