Abstract: Laminates have at least one resin-system layer, a low dielectric, low dissipation factor bond core having at least one surface that is treated for adhesion, such as by etching, plasma or Corona discharge or mechanical roughing to facilitate bonding to the at least one resin system layer and a conductive metal cladding on the at least one resin system layer. The bond core can be a fluoropolymer film or a fluoropolymer prepreg, having at least one etched or Corona discharge treated surface. Alternately, the bond core can be a polyetherimide film or a polyetherimide prepreg, having at least one etched or Corona discharge treated surface. The laminates are used, for example, high performance, low loss printed circuit boards. The laminates have the desired dielectric properties inherent to fluoropolymer materials and can be produced using conventional printed circuit board manufacturing processes, materials, and equipment. Methods of producing laminates are disclosed.