Patents by Inventor Mark E. Buckley

Mark E. Buckley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240082815
    Abstract: In some embodiments, the present disclosure relates to a system. The system includes a substrate and a fluid capture material formed on one or more surfaces of the substrate. The fluid capture material includes a sorbent material that binds one or more fluids, the one or more fluids comprising water, carbon dioxide, sulfur oxides, or a combination thereof. The fluid capture material also includes one or more binder materials, wherein the binder material is at least partially cross-linked.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: Michael Joseph O'Brien, David Roger Moore, William Christopher Alberts, Jingjing Yang, Mark Daniel Doherty, Mark D. Buckley, Jack E. Howson, Bryce E. Lipinski
  • Publication number: 20210173975
    Abstract: Embodiments provide mobile computing devices, related systems, and methods for controlling predictive modeling processes on a mobile device. An embodiment may provide a method for controlling predictive modeling processes on a mobile device, which may include receiving modeling data associated with a predictive model, receiving computation resources data of the mobile device, determining one or more predictive model processing parameters of the predictive model based on the modeling data and the computation resources data, formulating processing instructions based on the one or more predictive model processing parameters, and sending the modeling data and the processing instructions to the mobile device for execution of the predictive model. The parameters may include aspects of a sufficient number of tests, a type of predictive modeling simulation technique, client/server processing, and/or device responsive rendering.
    Type: Application
    Filed: November 12, 2020
    Publication date: June 10, 2021
    Inventors: Michael James LaBrie, Mark E. Buckley
  • Patent number: 5561292
    Abstract: An enclosed ion source for generating substantially monoenergetic ions from a gaseous sample comprises a chamber into which the gaseous sample is introduced and which is substantially enclosed by a source block having two electron entrance apertures formed in it and by a source plate having one ion extraction aperture formed in it. Two filaments are disposed outside the chamber and adjacent the electron entrance apertures. The electron impact ion source is characterized by the provision of an electrically conductive shield which is disposed within the chamber and which defines an equipotential region. The electrons, generated from a heated filament, pass into the chamber through one of the electron entrance apertures. The shield allows the passage of molecules of the gaseous sample and the electrons into the equipotential region, so that electron impact ionization of at least some of the sample occurs in the equipotential region.
    Type: Grant
    Filed: May 15, 1995
    Date of Patent: October 1, 1996
    Assignee: Fisons plc
    Inventors: Mark E. Buckley, Ian Koch, Andrew Stevenson
  • Patent number: 5214570
    Abstract: A memory module includes a mother board with an edge connector mounted adjacent one of its edges. Memory chips are mounted on the same side of the mother board as the edge connector. A daughter board, having memory chips mounted on its surface facing the mother board, is connected to the mother board so that its maximum height above the mother board is substantially no greater than that of the edge connector. Preferably the memory chips are mounted in thin TSOP packages and the daughter board is connected to the mother board by two rows of mating electrical pins and sockets, one located near the edge connector and the other near the top of the mother board, so the daughter board is mounted over virtually all of the width of the mother board except that covered by the edge connector, and so that the rows of mating connectors and the facing surfaces of the mother and daughter boards form an air channel through which air can flow to cool the memory chips mounted between the mother and daughter boards.
    Type: Grant
    Filed: April 3, 1992
    Date of Patent: May 25, 1993
    Assignee: Clearpoint Research Corporation
    Inventors: Bhupendra C. Shah, Charles F. Peterson, Mark E. Buckley