Patents by Inventor Mark E. Callahan

Mark E. Callahan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171416
    Abstract: Devices, systems and methods are provided for low-power and high-sampling rate of analog signals received from sensors transported by host devices. The devices, systems and methods may be adapted to utilize GPS and PPS signals for synchronization with digitized signals generated based on the sampling of the analog signals that are simultaneously received and processed by multiple channels. Synchronized data packets may be recorded by the disclosed data acquisition systems, and may be further transmitted to host devices and remote devices.
    Type: Application
    Filed: November 15, 2023
    Publication date: May 23, 2024
    Applicant: The United States of America as represented by the Secretary of the Navy
    Inventors: Mark E Paulus, Daniel A Gentile, Kevin D Jones, Kyler D Callahan, Paul R Leary, Vladimir N Dobrokhodov, Kevin B Smith
  • Patent number: 7465173
    Abstract: A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.
    Type: Grant
    Filed: January 15, 2007
    Date of Patent: December 16, 2008
    Assignee: ITT Manufacturing Enterprises, Inc.
    Inventor: Mark E. Callahan
  • Publication number: 20080169337
    Abstract: A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.
    Type: Application
    Filed: January 15, 2007
    Publication date: July 17, 2008
    Applicant: ITT MANUFACTURING ENTERPRISES, INC.
    Inventor: Mark E. Callahan