Abstract: A method of removing unwanted material from an article having a variable form can include scanning the article and determining, based on the scanning, a location of the unwanted material, determining tool paths of a cutting tool which will result in removal of the unwanted material, and displacing the cutting tool along the tool paths, thereby removing the unwanted material. A material removal system for removing unwanted material from an oilfield drill bit can include a rotary indexing device which rotates the drill bit about a longitudinal axis of the drill bit, a scanning device which scans an outer surface of the drill bit, and a controller which determines a geometry of the drill bit, based on at least one scan by the scanning device, determines a location of the unwanted material, and determines tool paths of a cutting tool for removal of the unwanted material.

Abstract: A method of removing unwanted material from an article having a variable form can include scanning the article and determining, based on the scanning, a location of the unwanted material, determining tool paths of a cutting tool which will result in removal of the unwanted material, and displacing the cutting tool along the tool paths, thereby removing the unwanted material. A material removal system for removing unwanted material from an oilfield drill bit can include a rotary indexing device which rotates the drill bit about a longitudinal axis of the drill bit, a scanning device which scans an outer surface of the drill bit, and a controller which determines a geometry of the drill bit, based on at least one scan by the scanning device, determines a location of the unwanted material, and determines tool paths of a cutting tool for removal of the unwanted material.

Abstract: The present invention provides an EMI shield having a low impedance connection to ground for use in electronic equipment, particularly computer systems. More particularly, an EMI shield for electronic equipment is disclosed which includes a conductive ribbon, such as a copper ribbon with a polyimide backing, the conductive ribbon having openings and coupled to a ground plane. The conductive ribbon contacts a surface of a section of the electronic equipment to be shielded. A hold down frame of a non-conductive material holds the conductive ribbon in a fixed position on the section of the electronic equipment to be shielded. A metal plating, such as a combination of copper and nickel, bonds to the section of the electronic equipment to be shielded and to the conductive ribbon. The metal plating contains the EMI.

Abstract: A composite powder specially adapted for use in selective laser sintering is disclosed. The composite powder includes a polymer powder dry mixed with a reinforcement powder, where the polymer powder has a melting temperature substantially lower than that of the reinforcement powder. In the case where nearfully dense parts are to be formed, the first constituent powder is preferably a semi-crystalline powder, for example nylon 11, of a composition suitable for forming near-fully dense parts when used unblended in selective laser sintering; if porous parts are desired, the polymer powder is an amorphous powder, such as polycarbonate, polystyrene, acrylates, and styrene/acrylate copolymers. The reinforcement powder is preferably microspheres of glass, preferably coated to enhance wetting and adhesion with the polymer powder when selective laser sintering is performed.