Patents by Inventor Mark Esformes

Mark Esformes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Porous structures produced by additive layer manufacturing
    Patent number: 10596660
    Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: March 24, 2020
    Assignee: Howmedica Osteonics Corp.
    Inventors: Thomas Francis McCarthy, Brock Miller, Robin Stamp, Yuri Zaitsev, Robert Klein, Mark Esformes, David Markel, Amit Mistry, Joseph Robinson
  • POROUS STRUCTURES PRODUCED BY ADDITIVE LAYER MANUFACTURING
    Publication number: 20170165790
    Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Inventors: Thomas Francis McCarthy, Brock Miller, Robin Stamp, Yuri Zaitsev, Robert Klein, Mark Esformes, David Markel, Amit Mistry, Joseph Robinson