Patents by Inventor Mark Ewing

Mark Ewing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8841146
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of coating a transparent substrate with a wavelength conversion material, continuously evaluating a correlated color temperature (CCT) of the output electromagnetic radiation produced by the wavelength conversion material and comparing the correlated color temperature (CCT) to a target correlated color temperature (CCT), and controlling the coating step responsive to feedback from the evaluating and comparing step to adjust the correlated color temperature (CCT) to achieve the target correlated color temperature (CCT). A system for fabricating light emitting diode (LED) dice includes a coating system, a monitoring system, and a control system configured to control the coating system to adjust the correlated color temperature (CCT) of the wavelength conversion material on the transparent substrate to achieve the target correlated color temperature (CCT).
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: September 23, 2014
    Assignee: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: Jui-Kang Yen, Georg Soerensen, Mark Ewing Tuttle
  • Publication number: 20130065327
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of coating a transparent substrate with a wavelength conversion material, continuously evaluating a correlated color temperature (CCT) of the output electromagnetic radiation produced by the wavelength conversion material and comparing the correlated color temperature (CCT) to a target correlated color temperature (CCT), and controlling the coating step responsive to feedback from the evaluating and comparing step to adjust the correlated color temperature (CCT) to achieve the target correlated color temperature (CCT). A system for fabricating light emitting diode (LED) dice includes a coating system, a monitoring system, and a control system configured to control the coating system to adjust the correlated color temperature (CCT) of the wavelength conversion material on the transparent substrate to achieve the target correlated color temperature (CCT).
    Type: Application
    Filed: July 31, 2012
    Publication date: March 14, 2013
    Applicant: SEMILEDS OPTOELECTRONICS CO., LTD.
    Inventors: Jui-Kang Yen, Georg Soerensen, Mark Ewing Tuttle
  • Patent number: 7971596
    Abstract: A portable confinement device for confining a person upon a mattress is provided. The device includes a frame and a flexible enclosure. The enclosure is supported by and sits upon the frame to stabilize the device from tipping over. A mattress may be received into the interior space of the enclosure. The enclosure includes an opening for allowing a person to enter or exit the interior space of the enclosure. All openings of the enclosure are designed to be unfastened only from outside of the enclosure.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: July 5, 2011
    Inventors: Rose Morris, Jeff Morris, Mark Ewing
  • Publication number: 20110048481
    Abstract: A portable confinement device for confining a person upon a mattress is provided. The device includes a frame and a flexible enclosure. The enclosure is supported by and sits upon the frame to stabilize the device from tipping over. A mattress may be received into the interior space of the enclosure. The enclosure includes an opening for allowing a person to enter or exit the interior space of the enclosure. All openings of the enclosure are designed to be unfastened only from outside of the enclosure.
    Type: Application
    Filed: September 2, 2009
    Publication date: March 3, 2011
    Inventors: Rose Morris, Jeff Morris, Mark Ewing
  • Publication number: 20090212397
    Abstract: A method of manufacturing an ultra thin integrated circuit comprises providing a substrate having a front side, a back side, and an edge extending from the front side to the back side; creating a defect layer in the substrate; forming semiconductor devices proximate the front side after creating the defect layer; and cleaving proximate the defect layer after forming the semiconductor devices. Other methods and apparatus are also provided.
    Type: Application
    Filed: February 18, 2009
    Publication date: August 27, 2009
    Inventor: Mark Ewing Tuttle
  • Publication number: 20090124038
    Abstract: A method of manufacturing a back side illuminated imager device comprises providing a substrate having a front side, a back side, and an edge extending from the front side to the back side; creating a defect layer in the substrate; defining an image array proximate the front side after creating the defect layer; and cleaving proximate the defect layer after defining the image array. Other methods and apparatus are also provided.
    Type: Application
    Filed: November 3, 2008
    Publication date: May 14, 2009
    Inventor: Mark Ewing Tuttle