Patents by Inventor Mark Fulcher

Mark Fulcher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
    Patent number: 5386341
    Abstract: Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.
    Type: Grant
    Filed: November 1, 1993
    Date of Patent: January 31, 1995
    Assignee: Motorola, Inc.
    Inventors: William L. Olson, David W. Currier, Tomasz L. Klosowiak, Mark Fulcher