Abstract: One method of the present invention includes preparing a die with traces and pads as desired for the intended use of the die. A MEMS device is mounted to the die. The die is then mounted to a substrate of the same material as the die. The substrate is then mounted to a package. The die and/or the substrate may be flip-chip mounted.

Abstract: A discrete stress isolation apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor device having a mechanism die and a package. A capacitive device mechanism is formed in a substrate layer positioned between the mechanism die and package substrate. A discrete stress isolation structure is formed in the same substrate layer with but physically separated from the capacitive device mechanism. The discrete stress isolation structure is interposed between the mechanism die and the package substrate and provides the mechanical and electrical attachment therebetween.

Abstract: One method of the present invention includes preparing a die with traces and pads as desired for the intended use of the die. A MEMS device is mounted to the die. The die is then mounted to a substrate of the same material as the die. The substrate is then mounted to a package. The die and/or the substrate may be flip-chip mounted.

Abstract: An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.

Abstract: An hermetic, gas filled or vacuum package device and method of making a vacuum package device. The device includes a device layer having one or more Micro Electro-Mechanical Systems (MEMS) devices. The device layer includes one or more electrical leads coupled to the one or more MEMS devices. The device also includes a first wafer having one or more silicon pins, wherein a first surface of the first wafer is bonded to a first surface of the device layer in such a manner that the one or more silicon pins are in electrical communication with the electrical leads. A second wafer, which may also have one or more silicon pins, is bonded to a second surface of the device layer. The first and second wafers are formed of borosilicate glass and the device layer is formed of silicon.

Abstract: An hermetic, gas filled or vacuum package device and method of making a vacuum package device. The device includes a device layer having one or more Micro Electro-Mechanical Systems (MEMS) devices. The device layer includes one or more electrical leads coupled to the one or more MEMS devices. The device also includes a first wafer having one or more silicon pins, wherein a first surface of the first wafer is bonded to a first surface of the device layer in such a manner that the one or more silicon pins are in electrical communication with the electrical leads. A second wafer, which may also have one or more silicon pins, is bonded to a second surface of the device layer. The first and second wafers are formed of borosilicate glass and the device layer is formed of silicon.

Abstract: A high aspect ratio microelectromechanical system device for measuring an applied force, the device being a cellular in-plane accelerometer formed of a base having a substantially planar mounting surface. A pair of substantially rigid fixed electrode structures are formed in a doped silicon mechanism layer, the fixed electrode structures having substantially parallel and mutually opposing pickoff electrode surfaces oriented substantially perpendicular to the planar mounting surface of the base and spaced apart along an input direction parallel with the planar mounting surface of the base, each of the fixed electrode structures being anchored to the mounting surface of the base. A pendulous electrostatic comb is formed in the doped silicon mechanism layer and oriented substantially perpendicular to the planar mounting surface of the base, the electrostatic comb being pendulously suspended from the mounting surface of the base between the fixed electrode structures for motion along the input direction.

Abstract: A Micro Electro-Mechanical System (MEMS) acceleration sensing device, formed of a an elongated sensing element of substantially uniform thickness suspended for motion relative to a rotational axis offset between first and second ends thereof such that a first portion of the sensing element between the rotational axis and the first end is longer than a shorter second portion between the rotational axis and the second end; a stationary silicon substrate spaced away from the sensing element; a capacitor formed by a surface of the substrate and each of the first and second portions of the sensing element; and a valley formed in the substrate surface opposite from the first longer portion of the sensing element and spaced away from the rotational axis a distance substantially the same as the distance between the rotational axis and the second end of the sensing element.

Abstract: A method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure.

Abstract: A hermetically sealed MEMS device having a micro-machined electromechanical device, a plurality of pillars at spaced-apart positions removed from the micro-machined electromechanical device, and a peripheral seal ring completely surrounding both the micro-machined electromechanical device and the pillars, all patterned in a layer of epitaxial semiconductor silicon. A glass cover is structured to cooperate with the micro-machined electromechanical device and is sealed by the seal ring. A plurality of pass-through windows are formed internal of the cover and communicate between inner and outer surfaces of the cover. Each of the pillars covers one of the windows. A plurality of internal electrical conductors electrically couple the micro-machined electromechanical device with a surface of each of the pillars.

Abstract: A Micro Electro-Mechanical System (MEMS) acceleration sensing device, formed of a an elongated sensing element of substantially uniform thickness suspended for motion relative to a rotational axis offset between first and second ends thereof such that a first portion of the sensing element between the rotational axis and the first end is longer than a shorter second portion between the rotational axis and the second end; a stationary silicon substrate spaced away from the sensing element; a capacitor formed by a surface of the substrate and each of the first and second portions of the sensing element; and a valley formed in the substrate surface opposite from the first longer portion of the sensing element and spaced away from the rotational axis a distance substantially the same as the distance between the rotational axis and the second end of the sensing element.

Abstract: A high aspect ratio microelectromechanical system device for measuring an applied force and having a suspension structure for compensating out-of-plane displacements of the device proof mass, wherein the device includes a frame; a proof mass coupled to the frame for in-plane motion along an axis of symmetry, the proof mass having first and second sets of spaced apart capacitor plates projected therefrom on each side of the axis of symmetry and oriented substantially crosswise to the axis of symmetry; and third and fourth sets of spaced apart capacitor plates oriented substantially crosswise to the axis of symmetry of the proof mass and intermeshed respectively with the first and second sets of capacitor plates, the third and fourth sets of capacitor plates being suspended for motion relative to the frame about respective first and second axes of motion oriented substantially parallel with the axis of symmetry of the proof mass.

Abstract: An apparatus and method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure.

Abstract: An apparatus and method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure.

Abstract: There is disclosed a composition containing a siloxane polymer for cleaning, polishing and lubricating surfaces. In addition to the siloxane polymer, the composition further contains a surface bonding enhancer, a lower alkyl alcohol, and a citrus extract. In further embodiments, the siloxane polymer composition may also contain a corrosion inhibitor and/or an anti-wearing agent. The siloxane polymer of this invention is a low viscosity siloxane polymer or a mixture of a low and high viscosity siloxane polymer. In a preferred embodiment, the citrus extract is d-limonene.