Patents by Inventor Mark J. Charney

Mark J. Charney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11675590
    Abstract: Disclosed embodiments relate to systems and methods for performing instructions to transform matrices into a row-interleaved format. In one example, a processor includes fetch and decode circuitry to fetch and decode an instruction having fields to specify an opcode and locations of source and destination matrices, wherein the opcode indicates that the processor is to transform the specified source matrix into the specified destination matrix having the row-interleaved format; and execution circuitry to respond to the decoded instruction by transforming the specified source matrix into the specified RowInt-formatted destination matrix by interleaving J elements of each J-element sub-column of the specified source matrix in either row-major or column-major order into a K-wide submatrix of the specified destination matrix, the K-wide submatrix having K columns and enough rows to hold the J elements.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: June 13, 2023
    Assignee: Intel Corporation
    Inventors: Raanan Sade, Robert Valentine, Bret Toll, Christopher J. Hughes, Alexander F. Heinecke, Elmoustapha Ould-Ahmed-Vall, Mark J. Charney
  • Patent number: 11669326
    Abstract: Embodiments detailed herein relate to matrix operations. For example, embodiments of instruction support for matrix (tile) dot product operations are detailed. Exemplary instructions including computing a dot product of signed words and accumulating in a quadword data elements of a matrix pair. Additionally, in some instances, non-accumulating quadword data elements of the matrix pair are set to zero.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: June 6, 2023
    Assignee: Intel Corporation
    Inventors: Raanan Sade, Simon Rubanovich, Amit Gradstein, Zeev Sperber, Alexander Heinecke, Robert Valentine, Mark J. Charney, Bret Toll, Jesus Corbal, Elmoustapha Ould-Ahmed-Vall, Menachem Adelman
  • Patent number: 11656870
    Abstract: Embodiments of systems, apparatuses, and methods for dual complex number multiplication and addition in a processor are described. For example, execution circuitry executes a decoded instruction to multiplex data values from positions in source operands to a multiplier, the source operands including pairs complex numbers, calculate a real part of a product of each pair of complex numbers, add the real part of the product of a first pair of complex numbers to the real part of the product of a second pair of complex numbers to calculate a first real result, and add the real part of the product of a third pair of complex numbers to the real part of the product of a fourth pair of complex numbers to calculate a second real result, and store the results to corresponding positions in the destination operand.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: May 23, 2023
    Inventors: Elmoustapha Ould-Ahmed-Vall, Venkateswara R. Madduri, Mark J. Charney, Robert Valentine
  • Patent number: 11645077
    Abstract: Embodiments detailed herein relate to systems and methods to zero a tile register pair. In one example, a processor includes decode circuitry to decode a matrix pair zeroing instruction having fields for an opcode and an identifier to identify a destination matrix having a PAIR parameter equal to TRUE; and execution circuitry to execute the decoded matrix pair zeroing instruction to zero every element of a left matrix and a right matrix of the identified destination matrix.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: May 9, 2023
    Assignee: Intel Corporation
    Inventors: Raanan Sade, Simon Rubanovich, Amit Gradstein, Zeev Sperber, Alexander Heinecke, Robert Valentine, Mark J. Charney, Bret Toll, Jesus Corbal, Elmoustapha Ould-Ahmed-Vall, Menachem Adelman, Eyal Hadas
  • Patent number: 11614936
    Abstract: Disclosed embodiments relate to computing dot products of nibbles in tile operands. In one example, a processor includes decode circuitry to decode a tile dot product instruction having fields for an opcode, a destination identifier to identify a M by N destination matrix, a first source identifier to identify a M by K first source matrix, and a second source identifier to identify a K by N second source matrix, each of the matrices containing doubleword elements, and execution circuitry to execute the decoded instruction to perform a flow K times for each element (m, n) of the specified destination matrix to generate eight products by multiplying each nibble of a doubleword element (M,K) of the specified first source matrix by a corresponding nibble of a doubleword element (K,N) of the specified second source matrix, and to accumulate and saturate the eight products with previous contents of the doubleword element.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: March 28, 2023
    Assignee: Intel Corporation
    Inventors: Alexander F. Heinecke, Robert Valentine, Mark J. Charney, Raanan Sade, Menachem Adelman, Zeev Sperber, Amit Gradstein, Simon Rubanovich
  • Patent number: 11609762
    Abstract: Embodiments detailed herein relate to systems and methods to load a tile register pair. In one example, a processor includes: decode circuitry to decode a load matrix pair instruction having fields for an opcode and source and destination identifiers to identify source and destination matrices, respectively, each matrix having a PAIR parameter equal to TRUE; and execution circuitry to execute the decoded load matrix pair instruction to load every element of left and right tiles of the identified destination matrix from corresponding element positions of left and right tiles of the identified source matrix, respectively, wherein the executing operates on one row of the identified destination matrix at a time, starting with the first row.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: March 21, 2023
    Assignee: Intel Corporation
    Inventors: Raanan Sade, Simon Rubanovich, Amit Gradstein, Zeev Sperber, Alexander Heinecke, Robert Valentine, Mark J. Charney, Bret Toll, Jesus Corbal, Elmoustapha Ould-Ahmed-Vall, Menachem Adelman
  • Publication number: 20230083705
    Abstract: Embodiments of systems, apparatuses, and methods for chained fused multiply add. In some embodiments, an apparatus includes a decoder to decode a single instruction having an opcode, a destination field representing a destination operand, a first source field representing a plurality of packed data source operands of a first type that have packed data elements of a first size, a second source field representing a plurality of packed data source operands that have packed data elements of a second size, and a field for a memory location that stores a scalar value. A register file having a plurality of packed data registers includes registers for the plurality of packed data source operands that have packed data elements of a first size, the source operands that have packed data elements of a second size, and the destination operand.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 16, 2023
    Inventors: JESUS CORBAL, ROBERT VALENTINE, ROMAN S. DUBTSOV, NIKITA A. SHUSTROV, MARK J. CHARNEY, DENNIS R. BRADFORD, MILIND B. GIRKAR, EDWARD T. GROCHOWSKI, THOMAS D. FLETCHER, WARREN E. FERGUSON
  • Publication number: 20230048998
    Abstract: Embodiments of systems, apparatuses, and methods for fused multiple add. In some embodiments, a decoder decodes a single instruction having an opcode, a destination field representing a destination operand, and fields for a first, second, and third packed data source operand, wherein packed data elements of the first and second packed data source operand are of a first, different size than a second size of packed data elements of the third packed data operand.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 16, 2023
    Inventors: Robert Valentine, Galina Ryvchin, Piotr Majcher, Mark J. Charney, Elmoustapha Ould-Ahmed-Vall, Jesus Corbal, Milind B. Girkar, Zeev Sperber, Simon Rubanovich, Amit Gradstein
  • Patent number: 11579880
    Abstract: Disclosed embodiments relate to systems for performing instructions to quickly convert and use matrices (tiles) as one-dimensional vectors. In one example, a processor includes fetch circuitry to fetch an instruction having fields to specify an opcode, locations of a two-dimensional (2D) matrix and a one-dimensional (1D) vector, and a group of elements comprising one of a row, part of a row, multiple rows, a column, part of a column, multiple columns, and a rectangular sub-tile of the specified 2D matrix, and wherein the opcode is to indicate a move of the specified group between the 2D matrix and the 1D vector, decode circuitry to decode the fetched instruction; and execution circuitry, responsive to the decoded instruction, when the opcode specifies a move from 1D, to move contents of the specified 1D vector to the specified group of elements.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: February 14, 2023
    Assignee: Intel Corporation
    Inventors: Bret Toll, Christopher J. Hughes, Dan Baum, Elmoustapha Ould-Ahmed-Vall, Raanan Sade, Robert Valentine, Mark J. Charney, Alexander F. Heinecke
  • Patent number: 11579883
    Abstract: Disclosed embodiments relate to systems and methods for performing instructions specifying horizontal tile operations. In one example, a processor includes fetch circuitry to fetch an instruction specifying a horizontal tile operation, a location of a M by N source matrix comprising K groups of elements, and locations of K destinations, wherein each of the K groups of elements comprises the same number of elements, decode circuitry to decode the fetched instruction, and execution circuitry to respond to the decoded instruction by generating K results, each result being generated by performing the specified horizontal tile operation across every element of a corresponding group of the K groups, and writing each generated result to a corresponding location of the K specified destination locations.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: February 14, 2023
    Assignee: Intel Corporation
    Inventors: Christopher J. Hughes, Bret Toll, Dan Baum, Elmoustapha Ould-Ahmed-Vall, Raanan Sade, Robert Valentine, Mark J. Charney, Alexander F. Heinecke
  • Patent number: 11579871
    Abstract: Embodiments of systems, apparatuses, and methods for performing vector-packed controllable sine and/or cosine operations in a processor are described. For example, execution circuitry executes a decoded instruction to compute at least a real output value and an imaginary output value based on at least a cosine calculation and a sine calculation, the cosine and sine calculations each based on an index value from a packed data source operand, add the index value with an index increment value from the packed data source operand to create an updated index value, and store the real output value, the imaginary output value, and the updated index value to a packed data destination operand.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: February 14, 2023
    Assignee: Intel Corporation
    Inventors: Venkateswara R. Madduri, Elmoustapha Ould-Ahmed-Vall, Robert Valentine, Jesus Corbal, Mark J. Charney, Carl Murray, Milind Girkar, Bret Toll
  • Patent number: 11567765
    Abstract: Embodiments detailed herein relate to matrix operations. In particular, the loading of a matrix (tile) from memory. For example, support for a loading instruction is described in the form of decode circuitry to decode an instruction having fields for an opcode, a destination matrix operand identifier, and source memory information, and execution circuitry to execute the decoded instruction to load groups of strided data elements from memory into configured rows of the identified destination matrix operand to memory.
    Type: Grant
    Filed: July 1, 2017
    Date of Patent: January 31, 2023
    Assignee: Intel Corporation
    Inventors: Robert Valentine, Menachem Adelman, Milind B. Girkar, Zeev Sperber, Mark J. Charney, Bret L. Toll, Rinat Rappoport, Jesus Corbal, Stanislav Shwartsman, Dan Baum, Igor Yanover, Alexander F. Heinecke, Barukh Ziv, Elmoustapha Ould-Ahmed-Vall, Yuri Gebil
  • Publication number: 20230004387
    Abstract: An apparatus and method for performing a vector packed multiplication of signed and unsigned words. For example, one embodiment of a processor includes a decoder to decode a vector packed multiply instruction having operands to identify a first and a second plurality of packed words, first and second source registers to store the first and second plurality of packed words, and execution circuitry to execute the decoded instruction. The execution circuitry includes multiplier circuitry to multiply each packed word in the first source register with a corresponding packed word in the second source register to generate a plurality of doubleword products and rounding circuitry to round each of the doubleword products according to a rounding method to generate a plurality of rounded doubleword products. Each upper word of the rounded doubleword results is then stored into a corresponding word data element positions of a destination register.
    Type: Application
    Filed: June 26, 2021
    Publication date: January 5, 2023
    Applicant: Intel Corporation
    Inventors: Venkateswara Rao Madduri, Robert Valentine, Mark J. Charney
  • Publication number: 20230004390
    Abstract: An apparatus and method for multiplying packed real and imaginary components of complex numbers and complex conjugates. For example, one embodiment of a processor comprises: a decoder to decode a first instruction to generate a decoded instruction; a first source register to store a first plurality of packed real and imaginary data elements; a second source register to store a second plurality of packed real and imaginary data elements; and execution circuitry to execute the decoded instruction. The execution circuitry includes multiplier circuitry to multiply select real and imaginary data elements in the first and second source registers to generate a plurality of real and imaginary products; adder circuitry to add/subtract various real and imaginary products, scale the results according to an immediate of the instruction, round the scaled results; and saturation circuitry to saturate the rounded results.
    Type: Application
    Filed: June 26, 2021
    Publication date: January 5, 2023
    Applicant: Intel Corporation
    Inventors: Venkateswara Rao Madduri, Robert Valentine, Mark J. Charney
  • Patent number: 11544058
    Abstract: Embodiments of systems, apparatuses, and methods for fused multiple add. In some embodiments, a decoder decodes a single instruction having an opcode, a destination field representing a destination operand, and fields for a first, second, and third packed data source operand, wherein packed data elements of the first and second packed data source operand are of a first, different size than a second size of packed data elements of the third packed data operand.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: January 3, 2023
    Assignee: Intel Corporation
    Inventors: Robert Valentine, Galina Ryvchin, Piotr Majcher, Mark J. Charney, Elmoustapha Ould-Ahmed-Vall, Jesus Corbal, Milind B. Girkar, Zeev Sperber, Simon Rubanovich, Amit Gradstein
  • Patent number: 11526353
    Abstract: Embodiments of systems, apparatuses, and methods for fused multiple add. In some embodiments, a decoder decodes a single instruction having an opcode, a destination field representing a destination operand, and fields for a first, second, and third packed data source operand, wherein packed data elements of the first and second packed data source operand are of a first, different size than a second size of packed data elements of the third packed data operand.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: December 13, 2022
    Assignee: Intel Corporation
    Inventors: Robert Valentine, Galina Ryvchin, Piotr Majcher, Mark J. Charney, Elmoustapha Ould-Ahmed-Vall, Jesus Corbal, Milind B. Girkar, Zeev Sperber, Simon Rubanovich, Amit Gradstein
  • Patent number: 11526354
    Abstract: Embodiments of systems, apparatuses, and methods for fused multiple add. In some embodiments, a decoder decodes a single instruction having an opcode, a destination field representing a destination operand, and fields for a first, second, and third packed data source operand, wherein packed data elements of the first and second packed data source operand are of a first, different size than a second size of packed data elements of the third packed data operand.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: December 13, 2022
    Assignee: Intel Corporation
    Inventors: Robert Valentine, Galina Ryvchin, Piotr Majcher, Mark J. Charney, Elmoustapha Ould-Ahmed-Vall, Jesus Corbal, Milind B. Girkar, Zeev Sperber, Simon Rubanovich, Amit Gradstein
  • Patent number: 11507369
    Abstract: Embodiments of systems, apparatuses, and methods for fused multiple add. In some embodiments, a decoder decodes a single instruction having an opcode, a destination field representing a destination operand, and fields for a first, second, and third packed data source operand, wherein packed data elements of the first and second packed data source operand are of a first, different size than a second size of packed data elements of the third packed data operand.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: November 22, 2022
    Assignee: Intel Corporation
    Inventors: Robert Valentine, Galina Ryvchin, Piotr Majcher, Mark J. Charney, Elmoustapha Ould-Ahmed-Vall, Jesus Corbal, Milind B. Girkar, Zeev Sperber, Simon Rubanovich, Amit Gradstein
  • Patent number: 11507376
    Abstract: Disclosed embodiments relate to instructions for fast element unpacking. In one example, a processor includes fetch circuitry to fetch an instruction whose format includes fields to specify an opcode and locations of an Array-of-Structures (AOS) source matrix and one or more Structure of Arrays (SOA) destination matrices, wherein: the specified opcode calls for unpacking elements of the specified AOS source matrix into the specified Structure of Arrays (SOA) destination matrices, the AOS source matrix is to contain N structures each containing K elements of different types, with same-typed elements in consecutive structures separated by a stride, the SOA destination matrices together contain K segregated groups, each containing N same-typed elements, decode circuitry to decode the fetched instruction, and execution circuitry, responsive to the decoded instruction, to unpack each element of the specified AOS matrix into one of the K element types of the one or more SOA matrices.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: November 22, 2022
    Assignee: Intel Corporation
    Inventors: Bret Toll, Alexander F. Heinecke, Christopher J. Hughes, Ronen Zohar, Michael Espig, Dan Baum, Raanan Sade, Robert Valentine, Mark J. Charney, Elmoustapha Ould-Ahmed-Vall
  • Publication number: 20220357950
    Abstract: Disclosed embodiments relate to systems and methods for performing instructions to transform matrices into a row-interleaved format. In one example, a processor includes fetch and decode circuitry to fetch and decode an instruction having fields to specify an opcode and locations of source and destination matrices, wherein the opcode indicates that the processor is to transform the specified source matrix into the specified destination matrix having the row-interleaved format; and execution circuitry to respond to the decoded instruction by transforming the specified source matrix into the specified RowInt-formatted destination matrix by interleaving J elements of each J-element sub-column of the specified source matrix in either row-major or column-major order into a K-wide submatrix of the specified destination matrix, the K-wide submatrix having K columns and enough rows to hold the J elements.
    Type: Application
    Filed: July 15, 2022
    Publication date: November 10, 2022
    Inventors: Raanan SADE, Robert VALENTINE, Bret TOLL, Christopher J. HUGHES, Alexander F. HEINECKE, Elmoustapha OULD-AHMED-VALL, Mark J. CHARNEY