Abstract: This invention relates to a wipe for killing spores comprising an absorbent sheet holding an aqueous composition and a sealed package containing the absorbent sheet, wherein the aqueous composition comprises water, an antimicrobial agent and a peroxide. The invention also relates to a process for killing spores using the above-indicated wipe.

Abstract: This invention relates to a process and an aqueous composition for killing spores. The process comprises contacting the spores with the aqueous composition for a sufficient period of time to effect a desired reduction (e.g., at least a 4 log reduction) in the number of spores capable of reproduction, metabolism and/or growth. The aqueous composition comprises water, peracetic acid and hydrogen peroxide. The concentration of peracetic acid in the water may be in the range from about 0.001 to about 60% by weight, or from about 0.001 to about 0.5% by weight. The weight ratio of peracetic acid to hydrogen peroxide may be in the range from about 0.001 to about 0.5.

Abstract: This invention relates to a a process for decontaminating or sterilizing an article contaminated with spores. The process comprises contacting the spores with a liquid sterilant for a sufficient period of time to effect a desired reduction (e.g., at least a 4 log reduction) in the number of spores capable of returning to vegetative growth. The liquid sterilant may comprise water, an antimicrobial agent (e.g., peracetic acid) and a peroxide (e.g., hydrogen peroxide).

Abstract: This invention relates to a wipe for killing spores comprising an absorbent sheet holding an aqueous composition and a sealed package containing the absorbent sheet, wherein the aqueous composition comprises water, an antimicrobial agent and a peroxide. The invention also relates to a process for killing spores using the above-indicated wipe.

Abstract: This invention relates to a wipe for killing spores comprising an absorbent sheet holding an aqueous composition and a sealed package containing the absorbent sheet, wherein the aqueous composition comprises water, an antimicrobial agent and a peroxide. The invention also relates to a process for killing spores using the above-indicated wipe.

Abstract: This invention relates to a wipe for killing spores comprising an absorbent sheet holding an aqueous composition and a sealed package containing the absorbent sheet, wherein the aqueous composition comprises water, an antimicrobial agent and a peroxide. The invention also relates to a process for killing spores using the above-indicated wipe.

Abstract: This invention relates to a wipe for killing spores comprising an absorbent sheet holding an aqueous composition and a sealed package containing the absorbent sheet, wherein the aqueous composition comprises water, an antimicrobial agent and a peroxide. The invention also relates to a process for killing spores using the above-indicated wipe.

Abstract: This invention relates to an aqueous composition and a process for killing spores. The process may comprise contacting the spores with the aqueous composition for a sufficient period of time to effect a desired reduction (e.g., at least a 4 log reduction) in the number of spores capable of returning to vegetative growth. The aqueous composition may comprise water, an antimicrobial agent (e.g., peracetic acid) and a peroxide (e.g., hydrogen peroxide). The process may be a two-step process involving the use of a first aqueous composition, which may comprise water and the peroxide, and a second aqueous composition which may comprise water and the antimicrobial agent.

Abstract: This invention relates to a a process for decontaminating or sterilizing an article contaminated with spores. The process comprises contacting the spores with a liquid sterilant for a sufficient period of time to effect a desired reduction (e.g., at least a 4 log reduction) in the number of spores capable of returning to vegetative growth. The liquid sterilant may comprise water, an antimicrobial agent (e.g., peracetic acid) and a peroxide (e.g., hydrogen peroxide).

Abstract: This invention relates to a process and an aqueous composition for killing spores. The process comprises contacting the spores with the aqueous composition for a sufficient period of time to effect a desired reduction (e.g., at least a 4 log reduction) in the number of spores capable of reproduction, metabolism and/or growth. The aqueous composition comprises water, peracetic acid and hydrogen peroxide. The concentration of peracetic acid in the water may be in the range from about 0.001 to about 60% by weight, or from about 0.001 to about 0.5% by weight. The weight ratio of peracetic acid to hydrogen peroxide may be in the range from about 0.001 to about 0.5.

Abstract: This invention relates to an aqueous composition and a process for killing spores. The process may comprise contacting the spores with the aqueous composition for a sufficient period of time to effect a desired reduction (e.g., at least a 4 log reduction) in the number of spores capable of returning to vegetative growth. The aqueous composition may comprise water, an antimicrobial agent (e.g., peracetic acid) and a peroxide (e.g., hydrogen peroxide). The process may be a two-step process involving the use of a first aqueous composition, which may comprise water and the peroxide, and a second aqueous composition which may comprise water and the antimicrobial agent.

Abstract: This invention relates to a decontamination or sterilization process wherein spores are killed, comprising: forming droplets of an aqueous composition comprising water and a peroxide, the aqueous composition having a concentration of peroxide in the range from about 0.01 to about 14% by weight; vaporizing the droplets to form a sporicidal vaporous mixture; and contacting the spores with the sporicidal vaporous mixture for a sufficient period of time to effect at least a 4 log reduction in the number of spores capable of returning to vegetative growth.