Patents by Inventor Mark Maggio

Mark Maggio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6979034
    Abstract: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: December 27, 2005
    Assignee: SpeedFam IPEC Corporation
    Inventors: Randy McNurlin, Mark Maggio, Michael Smigel, Ann Wilkey, James L. Farmer, Shawn Robertson
  • Publication number: 20040174029
    Abstract: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.
    Type: Application
    Filed: March 12, 2004
    Publication date: September 9, 2004
    Inventors: Randy McNurlin, Mark Maggio, Michael Smigel, Ann Wilkey, James L. Farmer, Shawn Robertson
  • Patent number: 6752442
    Abstract: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus, the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position, the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: June 22, 2004
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Randy McNurlin, Mark Maggio, Michael Smigel, Ann Wilkey, James L. Farmer, Shawn Robertson
  • Publication number: 20030092358
    Abstract: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.
    Type: Application
    Filed: November 9, 2001
    Publication date: May 15, 2003
    Inventors: Randy McNurlin, Mark Maggio, Michael Smigel, Ann Wilkey, James L. Farmer, Shawn Robertson
  • Patent number: 5995325
    Abstract: A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips. A plurality of head pads are located on the substrate to provide interconnection points. The intermediate strips have a plurality of electrically conductive pads with a hole therein, and each lead wire is electrically attached to a pad on the intermediate strip. Each intermediate strip is placed on the substrate such that each of the holes in the electrically conductive pads is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.
    Type: Grant
    Filed: April 20, 1994
    Date of Patent: November 30, 1999
    Assignee: Seagate Technology, Inc.
    Inventors: Mark Maggio, Tom Metzner, Steven Eckerd, Loren Skarky, Yoshiki Midori, Ray-Chung Yu, Cal Hardie
  • Patent number: 5555619
    Abstract: A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips. A plurality of head pads are located on the substrate to provide interconnection points. The intermediate strips have a plurality of electrically conductive pads with a hole therein, and each lead wire is electrically attached to a pad on the intermediate strip. Each intermediate strip is placed on the substrate such that each of the holes in the electrically conductive pads is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: September 17, 1996
    Assignee: Seagate Technology, Inc.
    Inventors: Mark Maggio, Tom Metzner, Steven Eckerd, Loren Skarky, Yoshiki Midori, Cal Hardie, Ray Yu