Patents by Inventor Mark Munch
Mark Munch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9176167Abstract: A conductive probe for semiconductor material characterization includes a distal metallic layer of micrometer-size particles, an intermediate layer of conformable conductive elastomer material, and a pin attached to the elastomer layer. The probe is preferably manufactured by filling a recess in a bottom plate with the metallic particles, coupling a top plate thereto with a perforation aligned with the recess, and filling the perforation with uncured conductive elastomer. The pin, preferably spring-loaded, is pressed into the perforation to compress the silicone to its intended probe size. The silicone is then allowed to cure at room temperature or in a heated environment, or both.Type: GrantFiled: December 14, 2012Date of Patent: November 3, 2015Assignee: BRUKER NANO INC.Inventors: Dong Chen, Mark Munch
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Patent number: 8602092Abstract: A closed loop cooling system and apparatus for controlling a fluid flow rate through the closed loop cooling system, the apparatus comprising a heat exchanger coupled to at least one heat generating device for removing waste heat from the heat generating device, at least one pump for circulating the fluid, a heat rejector for receiving the fluid, at least one fan for removing waste heat from the heat rejector, at least one temperature sensor coupled to the heat generating device to measure the temperature value of the at least one heat generating device, and a controller electrically coupled to the at least one pump, the at least one fan, and the at least one temperature sensor for receiving the temperature value to selectively control the fluid flow rate and the air flow rate, based on the temperature value.Type: GrantFiled: April 6, 2006Date of Patent: December 10, 2013Assignee: Cooligy, Inc.Inventors: Daniel J. Lenehan, Kenneth Goodson, Thomas W. Kenny, Mark Munch, Saroj Sahu
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Patent number: 8464781Abstract: A system for cooling a heat source includes a fluid heat exchanger, a pump, a thermoelectric device and a heat rejector. The thermoelectric device includes a cooling portion and a heating portion. The heat rejector is configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in the cooling system.Type: GrantFiled: October 17, 2006Date of Patent: June 18, 2013Assignee: Cooligy Inc.Inventors: Thomas W. Kenny, Mark Munch, Peng Zhou, James Gill Shook, Kenneth Goodson, Dave Corbin, Mark McMaster, James Lovette
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Patent number: 8157001Abstract: An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.Type: GrantFiled: March 30, 2007Date of Patent: April 17, 2012Assignee: Cooligy Inc.Inventors: James Hom, Girish Upadhya, Douglas E. Werner, Mark Munch, Paul Tsao, Bruce Conway, Peng Zhou, Richard Brewer
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Patent number: 8082683Abstract: A detachable material wrapped around a strap of a footwear guards against blister formation, provides comfort and a softer feel against a foot, and to add aesthetic value. In one embodiment, the detachable material is a strip made of self-fastening material. In another plurality of loops. The detachable material is reusable and adjustable.Type: GrantFiled: November 28, 2007Date of Patent: December 27, 2011Inventors: Mikako A. Munch, Yoshimi Munch, Mark Munch
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Patent number: 7913719Abstract: The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing layer. The inner tubing layer comes into contact with liquid and vapor. Vapor that might ordinarily diffuse through the tubing is impeded by the diffusion barrier layer. The diffusion barrier layer is a laminate comprising a diffusion barrier film with a very low vapor diffusion rate sandwiched between layers of thermoplastic. The diffusion barrier layer is wrapped around the inner tubing one or more times. The outer jacket layer is a polymeric jacket which is extruded onto the diffusion barrier layer wrapped inner tubing.Type: GrantFiled: January 29, 2007Date of Patent: March 29, 2011Assignee: Cooligy Inc.Inventors: Douglas Werner, Ali Firouzi, Mark Munch, Zbigniew Cichocki
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Patent number: 7836597Abstract: An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.Type: GrantFiled: January 6, 2006Date of Patent: November 23, 2010Assignee: Cooligy Inc.Inventors: Madhav Datta, Mark McMaster, Rick Brewer, Peng Zhou, Paul Tsao, Girish Upadhaya, Mark Munch
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Patent number: 7616444Abstract: One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.Type: GrantFiled: May 3, 2007Date of Patent: November 10, 2009Assignee: Cooligy Inc.Inventors: Mark Munch, Douglas E. Werner
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Patent number: 7599184Abstract: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.Type: GrantFiled: February 16, 2007Date of Patent: October 6, 2009Assignee: Cooligy Inc.Inventors: Girish Upadhya, Mark Munch, Norman Chow, Paul Tsao, Douglas E. Werner, Mark McMaster, Frederic Landry, Ian Spearing, Tim Schrader
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Patent number: 7591302Abstract: A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates to minimize power consumption, fan noise, and noise transients. The apparatus further includes at least one heat-generating device, at least one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans. The method includes controlling a fluid flow rate of at least one pump and an air flow rate of at least one fan, in a cooling system for cooling at least one device. The method comprises the steps of: providing at least one temperature sensor coupled to measure a temperature value of each device; receiving the temperature value from each temperature sensor; and providing a controller to selectively control the fluid flow rate and the air flow rate, based on each temperature value.Type: GrantFiled: December 8, 2003Date of Patent: September 22, 2009Assignee: Cooligy Inc.Inventors: Daniel J. Lenehan, Kenneth Goodson, Thomas W. Kenny, Mark Munch, Saroj Sahu
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Publication number: 20080210405Abstract: An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.Type: ApplicationFiled: January 6, 2006Publication date: September 4, 2008Inventors: Madhav Datta, Mark McMaster, Rick Brewer, Peng Zhou, Paul Tsao, Girish Upadhaya, Mark Munch
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Patent number: 7402029Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.Type: GrantFiled: April 20, 2005Date of Patent: July 22, 2008Assignee: Cooligy Inc.Inventors: Mark Munch, Kenneth Goodson, David Corbin, Shulin Zeng, Thomas W. Kenny, James Gill Shook
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Patent number: 7344363Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.Type: GrantFiled: April 20, 2005Date of Patent: March 18, 2008Assignee: Cooligy Inc.Inventors: Mark Munch, Kenneth Goodson, David Corbin, Shulin Zeng, Thomas W. Kenny, James Gill Shook
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Patent number: 7301773Abstract: A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.Type: GrantFiled: September 20, 2004Date of Patent: November 27, 2007Assignee: Cooligy Inc.Inventors: Richard Grant Brewer, Paul Tsao, Richard Herms, Mark Munch, Mark McMaster, Dave Corbin
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Patent number: 7278549Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.Type: GrantFiled: April 20, 2005Date of Patent: October 9, 2007Assignee: Cooligy Inc.Inventors: Mark Munch, Kenneth Goodson, David Corbin, Shulin Zeng, Thomas W. Kenny, James Gill Shook
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Publication number: 20070227708Abstract: An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure.Type: ApplicationFiled: March 30, 2007Publication date: October 4, 2007Inventors: James Hom, Girish Upadhya, Douglas E. Werner, Mark Munch, Paul Tsao, Bruce Conway, Peng Zhou, Richard Brewer
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Publication number: 20070227709Abstract: A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat source and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump for driving the fluid. The cooling system further includes a first radiator and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure. Some embodiments include a method of cooling the heat sources for a multi device configuration by using such a cooling system.Type: ApplicationFiled: March 29, 2007Publication date: October 4, 2007Inventors: Girish Upadhya, Douglas E. Werner, Mark Munch
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Publication number: 20070211431Abstract: One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.Type: ApplicationFiled: May 3, 2007Publication date: September 13, 2007Inventors: Mark Munch, Douglas Werner
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Publication number: 20070201204Abstract: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.Type: ApplicationFiled: February 16, 2007Publication date: August 30, 2007Inventors: Girish Upadhya, Mark Munch, Norman Chow, Paul Tsao, Douglas Werner, Mark McMaster, Frederic Landry, Ian Spearing, Tim Schrader
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Publication number: 20070193642Abstract: The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing layer. The inner tubing layer comes into contact with liquid and vapor. Vapor that might ordinarily diffuse through the tubing is impeded by the diffusion barrier layer. The diffusion barrier layer is a laminate comprising a diffusion barrier film with a very low vapor diffusion rate sandwiched between layers of thermoplastic. The diffusion barrier layer is wrapped around the inner tubing one or more times. The outer jacket layer is a polymeric jacket which is extruded onto the diffusion barrier layer wrapped inner tubing.Type: ApplicationFiled: January 29, 2007Publication date: August 23, 2007Inventors: Douglas Werner, Ali Firouzi, Mark Munch, Zbigniew Cichocki