Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.

Abstract: A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.

Abstract: A tamper-resistant lock assembly comprising a plate having a slot for receiving a key, the slot extending through the plate from an opening in a front face thereof to an exit in an opposing rear face thereof, the opening having a first profile and the exit having a second, different profile, the key comprising a shaft having a bit extending therefrom, the bit being formed of a shape memory material and being pre-configured such that its cross-sectional shape in its temporary form matches the first profile and the bit can be inserted through the slot via the opening and, upon application of a predetermined external stimulus, returns to a permanent form in which its cross-sectional shape matches the second profile and the bit can be retracted from the slot via the exit.

Abstract: Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.

Abstract: An electric packaging including a board and a mechanical component attached to the board. The mechanical component includes a first end attached to the board, a second end opposite the first end, and a seat interposed between the first end and the second end. The mechanical component also includes an upper portion extending from the second end to the seat, the upper portion having a first width and a lower portion extending from the seat to the first end. The lower portion having a second width that is less than the first width. The electric packaging also includes a connector attached to the board. The connector includes a first surface attached to the board and a second surface located opposite the first surface. The second surface includes a plug connection area sized to receive a plug and located completely radially outside of the first width.

Abstract: An electric packaging including a board and a mechanical component attached to the board. The mechanical component includes a first end attached to the board, a second end opposite the first end, and a seat interposed between the first end and the second end. The mechanical component also includes an upper portion extending from the second end to the seat, the upper portion having a first width and a lower portion extending from the seat to the first end. The lower portion having a second width that is less than the first width. The electric packaging also includes a connector attached to the board. The connector includes a first surface attached to the board and a second surface located opposite the first surface. The second surface includes a plug connection area sized to receive a plug and located completely radially outside of the first width.

Abstract: A heat transfer device includes a base and a heat sink coupled to the base. The heat sink includes a fin with a surface for receiving a cooling medium to travel across, thereby defining an upstream end and a downstream end for the fin. An airflow projection is coupled to the surface of the fin, in which the airflow projection includes an upstream end and a downstream end with the downstream end of the airflow projection cantilevered above the surface of the fin.

Abstract: Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.

Abstract: A waveguide comprising first and second waveguide sections, each waveguide section comprising a main body portion (12) and a connecting portion (14) at its distal end, said first and second waveguide sections being longitudinally aligned to define a conduit therethrough with a butted interface (28) therebetween, the connecting portion of each waveguide section having: (i) a first circumferential ridge (16) on its outer surface located adjacent its distal end, (ii) a second circumferential ridge (18) on its outer surface spaced apart from the first circumferential ridge, and (iii) a third circumferential ridge (20) on its outer surface located between said first and second circumferential ridges, such that a first respective recess (19) is defined between said second and third circumferential ridges and a second respective recess (17) is defined between said first and third circumferential ridges; the waveguide further comprising a sleeve member (22) over said butted interface (28), such that a respective firs

Abstract: A heat transfer device includes a base and a heat sink coupled to the base. The heat sink includes a fin with a surface for receiving a cooling medium to travel across, thereby defining an upstream end and a downstream end for the fin. An airflow projection is coupled to the surface of the fin, in which the airflow projection includes an upstream end and a downstream end with the downstream end of the airflow projection cantilevered above the surface of the fin.

Abstract: A tamper-resistant lock assembly comprising a plate having a slot for receiving a key, the slot extending through the plate from an opening in a front face thereof to an exit in an opposing rear face thereof, the opening having a first profile and the exit having a second, different profile, the key comprising a shaft having a bit extending therefrom, the bit being formed of a shape memory material and being pre-configured such that its cross-sectional shape in its temporary form matches the first profile and the bit can be inserted through the slot via the opening and, upon application of a predetermined external stimulus, returns to a permanent form in which its cross-sectional shape matches the second profile and the bit can be retracted from the slot via the exit.

Abstract: A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.

Abstract: A waveguide comprising first and second waveguide sections, each waveguide section comprising a main body portion (12) and a connecting portion (14) at its distal end, said first and second waveguide sections being longitudinally aligned to define a conduit therethrough with a butted interface (28) therebetween, the connecting portion of each waveguide section having: (i) a first circumferential ridge (16) on its outer surface located adjacent its distal end, (ii) a second circumferential ridge (18) on its outer surface spaced apart from the first circumferential ridge, and (iii) a third circumferential ridge (20) on its outer surface located between said first and second circumferential ridges, such that a first respective recess (19) is defined between said second and third circumferential ridges and a second respective recess (17) is defined between said first and third circumferential ridges; the waveguide further comprising a sleeve member (22) over said butted interface (28), such that a respective firs

Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).