Patents by Inventor Mark R. Kordus

Mark R. Kordus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
    Patent number: 5545429
    Abstract: The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: August 13, 1996
    Assignee: International Business Machines Corporation
    Inventors: Richard B. Booth, Emanuel I. Cooper, Edward A. Giess, Mark R. Kordus, Sol Krongelb, Steven P. Ostrander, Judith M. Roldan, Carlos J. Sambucetti, Ravi Saraf
  • Structures for electrically conductive decals filled with inorganic insulator material
    Patent number: 5338900
    Abstract: The present invention relates generally to new structures for decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: August 16, 1994
    Assignee: International Business Machines Corporation
    Inventors: Mark S. Schneider, John Acocella, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz
  • Structures for electrically conductive decals filled with organic insulator material
    Patent number: 5306872
    Abstract: The present invention relates generally to new decal structures, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: April 26, 1994
    Assignee: International Business Machines Corporation
    Inventors: Mark R. Kordus, Mark S. Schneider, Louis H. Wirtz
  • Processes for electrically conductive decals filled with organic insulator material
    Patent number: 5116459
    Abstract: The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: May 26, 1992
    Assignee: International Business Machines Corporation
    Inventors: Mark R. Kordus, Mark S. Schneider, Louis H. Wirtz
  • Processes for electrically conductive decals filled with inorganic insulator material
    Patent number: 5108541
    Abstract: The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: April 28, 1992
    Assignee: International Business Machines Corp.
    Inventors: Mark S. Schneider, John Acocella, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz