Patents by Inventor Mark Radosavljevic

Mark Radosavljevic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978799
    Abstract: A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: May 7, 2024
    Assignee: Tahoe Research, Ltd.
    Inventors: Justin K. Brask, Robert S. Chau, Suman Datta, Mark L. Doczy, Brian S. Doyle, Jack T. Kavalieros, Amlan Majumdar, Matthew V. Metz, Marko Radosavljevic
  • Patent number: 11705882
    Abstract: Modern RF front end filters feature acoustic resonators in a film bulk acoustic resonator (FBAR) structure. An acoustic filter is a circuit that includes at least (and typically significantly more) two resonators. The acoustic resonator structure comprises a substrate including sidewalls and a vertical cavity between the sidewalls and two or more resonators deposited in the vertical cavity.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: July 18, 2023
    Assignee: Intel Corporation
    Inventors: Paul Fischer, Mark Radosavljevic, Sansaptak Dasgupta, Han Wui Then
  • Publication number: 20190341899
    Abstract: Modern RF front end filters feature acoustic resonators in a film bulk acoustic resonator (FBAR) structure. An acoustic filter is a circuit that includes at least (and typically significantly more) two resonators. The acoustic resonator structure comprises a substrate including sidewalls and a vertical cavity between the sidewalls and two or more resonators deposited in the vertical cavity.
    Type: Application
    Filed: December 29, 2016
    Publication date: November 7, 2019
    Applicant: Intel Corporation
    Inventors: Paul FISCHER, Mark RADOSAVLJEVIC, Sansaptak DASGUPTA, Han Wui THEN
  • Publication number: 20130032783
    Abstract: Techniques are disclosed for forming a non-planar germanium quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a germanium fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), a doping layer (e.g., delta/modulation doped), and an undoped germanium quantum well layer. An undoped germanium fin structure is formed in the quantum well structure, and a top barrier layer deposited over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.
    Type: Application
    Filed: October 9, 2012
    Publication date: February 7, 2013
    Inventors: Ravi Pillarisetty, Jack T. Kavalieros, Willy Rachmady, Uday Shah, Benjamin Chu-Kung, Mark Radosavljevic, Niloy Mukherjee, Gilbert Dewey, Been Y. Jin, Robert S. Chau