Abstract: A scribing machine adapter plate is configured to receive and couple a hoop assembly to a chuck on a scribing machine. The adapter plate includes an upper surface and an inner annular vacuum groove and an outer annular vacuum groove formed in the upper surface. A third vacuum groove extends radially between, and communicates with, the inner and outer grooves. The outer vacuum groove includes a vacuum inlet hole that extends from the groove through the adapter plate to provide communication between a vacuum channel in the chuck and the vacuum grooves in the plate. The polymer film of the hoop assembly is disposed on the upper surface to seal the vacuum grooves to hold the film in place during scribing of materials placed on the film.

Abstract: A system for adhering a plurality of parts to a support film is provided. The parts are positioned between a support base with a heater and a cover membrane. The cover membrane is located beneath a sealed chamber. The chamber has an inlet through which gas is input. A downward force caused by gas pressure in the chamber causes the cover membrane to contact the parts and presses the plurality of parts against the film. A heating device heats the film to cause the parts to adhere to the film.

Abstract: A storage container for semiconductor objects is disclosed. The invention has a mounting structure having an inner frame, a temperature sensitive adherent film and an outer frame. Semiconductor objects are placed on the temperature sensitive adherent and covered. The cover does not touch the semiconductor objects because it has a spacer made of non-stick material. The invention stores semiconductor objects for a relatively long period of time in a safe and secure manner with minimal threat of breakage.

Abstract: A method and apparatus utilizing a thermal release mounting material to adhere a laser wafer to a wafer support during a semiconductor fabrication process is provided. A first surface of the mounting material contains an adhesive and is adhered to a wafer support. The wafer support contains apertures for allowing air bubbles to escape while the mounting material is being applied to the wafer support, thus, ensuring that the film is planar to the support. The laser wafer is adhered to a second surface of the mounting material. The second surface of the mounting material comprises a thermal release material. After undergoing the fabrication process, the thermal release material of the mounting material is heated to a release temperature allowing the laser wafer to be readily removed from the wafer support.

Abstract: A method and apparatus are disclosed for testing individual laser chips located on a laser bar containing a plurality of chips. Laser bars are transported widthwise on a moving plastic film sheet, which is passed over an elongated pedestal which is aligned with the film sheet. The pedestal has a width which is less than the length of a laser bar, so that the unsupported portion of the plastic film under the ends of the laser bars may be drawn downward and away from the bar. This provides access to the metalized underside of the bar, which serves as a common N-contact for all of the laser chips on the bar. A probe is placed in contact with the undersurface of the bar, and at least one additional probe is placed in contact with a P-contact on one of the laser devices. A chip activation signal is applied between the two probes, and a sensor detects whether or not the chip being probed emits radiation. Failure to emit radiation or to emit radiation in an expected manner is indicative of a bad chip.

Abstract: A slot is formed behind each face of a stackable laser bar spacer of the type having a laser bar supporting face and a lower face for contacting a laser bar therebelow, each slot being generally parallel to the face in front of it and being located near an edge thereof. This produces a thin, flap-like portion at an end of each face. When it is desired to release a stuck laser bar from a face, this flap portion is caused to flex in the direction of the laser bar. The laser bar, being relatively inflexible, will be lifted away from the corresponding face, breaking free thereof. The stacked spacers may then be separated and the laser bars removed therefrom.

Abstract: A system is provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device and coating fixture combination provide an uncomplicated and reliable system for handling the bars.

Abstract: A device and method for the automated rotating of semiconductor objects during the fabrication process is disclosed. The device uses a slotted base fixture with a channel, lifting members with ducts, and a vacuum. Semiconductor objects are rotated from a vertical position to a substantially horizontal essentially evenly spaced parallel configuration. The positioning of the semiconductor objects by the device is such that the facet end of each semiconductor object remains undisturbed. The configuration of the semiconductor objects allows for quick and easy transfer to a storage surface or transfer to further semiconductor processing steps.

Abstract: An apparatus and a method for non-contact cleaving a brittle, non-metallic solid material, such as semiconductor material, glass, quartz, ceramic or like material. A pulsating gas jet directs a jet of gas toward a support structure formed of a non-compliant material. The semiconductor material is positioned on the support structure between a pair of film layers. The semiconductor material is scored in at least one location on the material. A plastic buffer material is adhered to the support structure. The semiconductor material and the film layers are moved along the support structure until the score line is at a ledge of the support structure and underneath the source of gas. The jet of gas applies a sufficient force to cleave the semiconductor material as it passes off the ledge of the support structure, while minimizing vibration and/or turbulence. The buffer provides cushioning and inhibits the formation of fractures during the cleaving process.

Abstract: An apparatus and method for minimizing electrostatic discharge damage to semiconductor objects utilizes an ionized air stream to reduce electrostatic and triboelectric potential build up in and surrounding semiconductor storage containers. The ionized air stream is continuously directed to a designated area where stored semiconductor objects are being removed from. Electrostatic and triboelectric potential is greatly reduced, minimizing the threat of electrostatic discharge and damage.

Abstract: A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets.

Abstract: A method of transporting a laser bar, such as from a facet coat holding fixture, and an apparatus for implementing the same. A vacuum collet is automatically positioned at a predetermined position vertically and horizontally offset with respect to a facet of the laser bar. A vacuum is then applied to the vacuum collet to pull the laser bar against it and hold the laser bar in place. Since the vacuum collet is offset horizontally as well as vertically from the bar, the laser bar flips by 90.degree. when the vacuum is applied such that the laser bar longitudinal surface winds up abutting a bottom surface of the vacuum collet, and contact with the laser bar facets is substantially avoided. The vacuum collet is then transported while the vacuum is maintained to thereby transport the laser bar.

Abstract: A method and apparatus for removing a component retained to a film carrier by an adhesive bonding force exerted on the component by the film carrier. The method includes the steps of supporting a section of the film carrier lying beneath the component; pulling a portion of the supported film carrier section away from the component to substantially reduce the adhesive bonding force exerted on the component by the film carrier; and lifting the component off the film carrier. The apparatus for performing the method includes a convex-shaped base element having a slot which applies at least a partial vacuum that pulls the portion of the film carrier away from the component and a component pickup element for lifting the component off the film carrier.

Abstract: The conforming, tungsten carbide collet utilized for odd shaped integrated circuit structures is replaced by a plurality of individual collects of the type utilized for integrated circuits. These are typically made of polymide, which is substantially softer than tungsten carbide. In a preferred embodiment, the elongated collect usually used with respect to laser bars is replaced by two individual collects of the type described, which contact the laser bars only near their ends.

Abstract: An apparatus and a method for receiving and transporting semiconductor chips. The chips are placed in pockets on a top surface of a first carrier. A similar carrier has an adhesive sheet placed on its top surface, and it is inverted and placed on the first carrier. A vacuum is pulled on orifices leading to the pockets. The vacuum pulls the flexible sheet into contact with the chips. The second carrier is then removed from the first carrier. Air pressure may be introduced to assist in the removal. A cover may be placed over the second carrier.

Abstract: Apparatus and method for retaining a laser bar during a facet coating operation and releasing the laser bar subsequent to the operation. The apparatus includes a pair of opposing spacers that hold the laser bar when compressed, each spacer including a compliant spring on an inner portion thereof. A compression device applies a force to the spacers sufficient to compress the springs against opposite sides of the laser bar to thereby retain the laser bar during the facet coating operation. Subsequent to the facet coating operation, the compressive force is released to decompress the springs and thereby release the laser bar. Due to the spring action, the laser bar is released without substantially adhering to either one of the spacers.

Abstract: The invention disclosed is a method and apparatus for cleaving semiconductor material without physical contact. Tick marks are formed in a major surface of the material where cleaving is desired. A fulcrum member is moved with respect to the material until a tick mark is in alignment with the fulcrum member. A gas jet, also aligned with the fulcrum member, is applied to the surface of the material to form the cleave.

Abstract: A system for positioning an article at a predetermined angular orientation with respect to a vacuum collet comprising a vacuum collet having an article pickup surface; and an alignment ledge overhanging the pickup surface, wherein the alignment ledge is at a predetermined angular orientation with respect to the vacuum collet.

Abstract: The invention is a method for handling material which may be in the form of semiconductor wafers, bars, and/or chips. The material is mounted to a flexible film which is heated so as to result in an adhesion strength sufficient to hold the material in place, but low enough so that the material can be removed easily when desired.

Abstract: A vacuum collet for handling semiconductor piece parts is formed to include a plurality of separate vacuum ports, disposed in proximity to one another. By selectively turning the vacuum ports "on" and "off", with only one vacuum port turned "on" at a time, a semiconductor chip may be articulated through various 90.degree. rotations to provide the orientation required for placement of the semiconductor chip on a final assembly.