Patents by Inventor Mark S. Frater

Mark S. Frater has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminated entry and exit material for drilling printed circuit boards
    Patent number: 6783860
    Abstract: A laminated entry and exit material for drilling planar sheets such as printed circuit boards having a metal foil layer bonded to a fibrous core layer with an adhesive containing a particulate lubricant such as graphite or polyethylene glycol and cold or hot pressed. A second metal layer is preferably bonded to the fibrous core layer. The core of one embodiment of the exit material includes a particulate lubricant such as graphite or polyethylene glycol incorporated in the core at the time of manufacture of the core. The circuit board is placed between the entry and exit materials. Drill friction and heat are reduced by the lubricants and the heat sink provided by the foil thereby extending the service life of a drill.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: August 31, 2004
    Assignee: R. E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Separator sheet laminate for use in the manufacture of printed circuit boards
    Patent number: 6355360
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasably bonded with resistance welds and adhesive to at least one surface of the substrate layer.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: March 12, 2002
    Assignee: R.E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Copper/steel laminated sheet for use in manufacturing printed circuit boards
    Patent number: 6235404
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: May 22, 2001
    Assignee: R.E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Copper/steel laminated sheet for use in manufacturing printed circuit boards
    Patent number: 6129990
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: October 10, 2000
    Assignee: R. E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Copper and steel components for use in manufacturing printed circuit boards
    Patent number: 6130000
    Abstract: A corrosion resistant sheet alloy separator sheet for use in a press lay-up between printed circuit board panels.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: October 10, 2000
    Assignee: R. E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Copper/steel laminated sheet for use in manufacturing printed circuit boards
    Patent number: 6129998
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel alloy substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of occurrences of adhesive material disposed along the boundary of the foil layer such that gaps are defined between occurrences of the adhesive material.
    Type: Grant
    Filed: April 10, 1998
    Date of Patent: October 10, 2000
    Assignee: R.E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Copper/steel laminated sheet for use in manufacturing printed circuit boards
    Patent number: 6127051
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a metal substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of metal-to-metal bonds disposed along the boundary of the foil layer such that gaps are defined between the bonds.
    Type: Grant
    Filed: October 29, 1998
    Date of Patent: October 3, 2000
    Assignee: R. E. Service Company, Inc.
    Inventor: Mark S. Frater