Abstract: A connector arrangement for providing electrical interconnection between coresponding contact pads of opposed first and second circuit boards includes an electrically nonconductive support member disposed between the boards, a bodily-rotatable, electrically conductive interconnect element extending through the thickness of the support and having a pair of pad engagement surfaces disposed to engage the respective contact pads, and a clamp for retaining the circuit boards in a clamped-together relationship with the support member in a compressed, reduced thickness state and with the interconnect member bodily rotated. The support member includes resilient elastomeric material, has support surfaces respectively opposed to the board surfaces, and is adapted to be compressed by urging of the boards together.