Abstract: An integrated circuit (IC) package comprises a substrate having an outer portion close to the perimeter of the substrate, an inner portion surrounded by the outer portion, and an upper surface incorporating a wiring layer for the bonding of a semiconducting die (e.g., via its bottom face). The IC package includes a metallic or otherwise thermally conductive heat spreader thermally bonded on an inner surface of a boss on its bottom side to the top surface of the semiconducting die, and extending on its top surface to the edges of the substrate to maximize heat dissipation from the die. The boss extends toward the semiconducting die and is thermally coupled to the top face of the semiconducting die.

Abstract: A method for shielding an electrical circuit may include depositing a potting material upon the electrical circuit. The method may include providing a path to a ground of the electrical circuit. The method may also include depositing an electrically conductive coating upon the electrical circuit and over the potting material. The method may further include connecting the electrically conductive coating to the ground of the electrical circuit.

Abstract: The present invention is directed to use of a polyamide thermal plastic as a potting compound for potting electronic components (ex.—printed circuit boards) of an electronics assembly which is implemented in a munition. Use of the polyamide thermal plastic as a potting compound allows for a gun-hardened electronics assembly. Use of the polyamide thermal plastic as a potting compound also allows for reworkability. For example, during early testing phases of the electronics assembly, the potting material of the present disclosure may be removable (ex.—such as via a hot solvent bath) from the electronics assembly so that the electronics components may be: examined to determine the cause(s) for low yield during testing; and/or fixed, rather than having to rebuild the entire electronics assembly, thereby promoting lower costs of producing the electronics assembly.

Abstract: Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, a flame retardant compound such as melamine cyanurate, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions exhibit improved flame retardancy. Also, when multifunctional epoxy resins and multifunctional phenolic hardeners such as those derived from phenol with a degree of branching of at least three are used, the molding compounds including the quaternary organophosphonium salt as a catalyst exhibit long flow and low shrinkage and warpage.

Abstract: In accordance with the present invention, methods have been developed for the reduction of the chloride content of epoxy compound starting materials. Invention methods comprise fractionating an epoxy compound starting material into portions (e.g., fractions or cuts) having different chloride content relative to the epoxy compound starting material. Certain of these collected portions (i.e., the portions fractionated and collected after collection of the forecut and before discontinuation of the fractionation) contain substantially reduced chloride levels relative to the epoxy compound starting material.