Patents by Inventor Mark Tiam Weng Lam

Mark Tiam Weng Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Screening methodology to eliminate wire sweep in bond and assembly module packaging
    Patent number: 10605850
    Abstract: Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: March 31, 2020
    Assignee: International Business Machines Corporation
    Inventors: Stephen Peter Ayotte, Michael Russell Uy Gonzales, Mark Tiam Weng Lam
  • Screening Methodology to Eliminate Wire Sweep in Bond and Assembly Module Packaging
    Publication number: 20170016950
    Abstract: Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.
    Type: Application
    Filed: September 28, 2016
    Publication date: January 19, 2017
    Applicant: International Business Machines Corporation
    Inventors: Stephen Peter Ayotte, Michael Russell Uy Gonzales, Mark Tiam Weng Lam
  • Screening methodology to eliminate wire sweep in bond and assembly module packaging
    Patent number: 9470740
    Abstract: Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 18, 2016
    Assignee: International Business Machines Corporation
    Inventors: Stephen Peter Ayotte, Michael Russell Uy Gonzales, Mark Tiam Weng Lam