Patents by Inventor Mark William Hudson

Mark William Hudson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973268
    Abstract: This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: April 30, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson
  • Patent number: 11962087
    Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: April 16, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson, Sophie Macfarland
  • Publication number: 20230378656
    Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
    Type: Application
    Filed: February 1, 2023
    Publication date: November 23, 2023
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson, Sophie Macfarland
  • Publication number: 20230208016
    Abstract: This document describes techniques, apparatuses, and systems of a metal antenna assembly with integrated features. The described antenna assembly comprises an antenna structure including an antenna body having at least one antenna element formed from a metal alloy while in a thixotropic state. The antenna structure includes a surface having a corrosion inhibitor coating. The antenna assembly further includes an air-waveguide structure. In implementations, the antenna structure is configured to attach to a mounting. The antenna structure includes at least one integrated alignment feature promoting alignment during manufacturing of the antenna assembly. The antenna structure further includes an internal portion in the antenna body defining an integrated heatsink portion and an integrated electromagnetic interference portion within which circuit components can reside.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson, Sophie Macfarland, Dennis C. Nohns
  • Patent number: 11616306
    Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 28, 2023
    Assignee: Aptiv Technologies Limited
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson, Sophie Macfarland
  • Publication number: 20220352640
    Abstract: This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 3, 2022
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson
  • Publication number: 20220302570
    Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
    Type: Application
    Filed: June 21, 2021
    Publication date: September 22, 2022
    Inventors: Scott D. Brandenburg, David Wayne Zimmerman, Mark William Hudson, Sophie Macfarland
  • Publication number: 20220179039
    Abstract: This document describes facia, including parts of vehicles, for supporting an ultra-wide radar field-of-view, for example, in automotive contexts. The facia is configured as a radome for supporting an ultra-wide field-of-view with an antenna despite the facia obstructing a field of view. The facia has one exterior surface or interior surface this is a mostly smooth or has a pattern of hemispherical indentations or domes that are configured to reduce reflections off that surface and increase light transmission through the facia. The other of the exterior or interior surface, has a pattern of hemispherical indentations or domes that are configured to reduce reflections off that surface and further increase light transmission through the facia.
    Type: Application
    Filed: November 19, 2021
    Publication date: June 9, 2022
    Inventors: Syed An Nazmus Saqueb, Armin Talai, Kevin Paul McReynolds, Ricardo Cavazos, Mark William Hudson
  • Patent number: 6043937
    Abstract: A head up display system having a diffusing image plane or diffuser. The light output of a relatively small image source is imaged on the diffuser by way of imaging optics. A mirror is used to image light from the diffuser onto a windshield and correct for distortion caused by the windshield. The diffuser is advantageously used when a large field-of-view is desired, or sun load characteristics need to be addressed. The diffuser may be flat or curved in order to optimize the system for different applications. The magnification of the mirror may be made relatively low, and the solar energy density that is made incident on the image source is reduced, providing for a low cost, high performance, color head up display system.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: March 28, 2000
    Assignee: Delphi Technologies, Inc.
    Inventors: Mark William Hudson, Ning Wu, Doyle Joseph Groves, Timothy James Newman, Dale James Igram, Jianhua Li, Gerald Jay Witt, Mark Anthony Koors, Mark Robert Vincen