Patents by Inventor Mark William Kapfhammer
Mark William Kapfhammer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11694992Abstract: An integrated circuit package structure is provided that includes a chip carrier substrate, at least one processor die provided on the chip carrier substrate, a plurality of lateral escape wiring lines connected to and extending away from the at least one processor die, and a plurality of chips at least partially surrounding the processor die, at least one of the chips overlapping with at least one of the lateral escape wiring lines in a plan view. An interconnect structure of the chips includes at least one vertical power feed structure that is configured and positioned not to intersect with the lateral escape wiring lines in the plan view.Type: GrantFiled: February 22, 2021Date of Patent: July 4, 2023Assignee: International Business Machines CorporationInventors: Charles Leon Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas Edward Lombardi, Shidong Li, Mark William Kapfhammer
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Publication number: 20220271005Abstract: An integrated circuit package structure is provided that includes a chip carrier substrate, at least one processor die provided on the chip carrier substrate, a plurality of lateral escape wiring lines connected to and extending away from the at least one processor die, and a plurality of chips at least partially surrounding the processor die, at least one of the chips overlapping with at least one of the lateral escape wiring lines in a plan view. An interconnect structure of the chips includes at least one vertical power feed structure that is configured and positioned not to intersect with the lateral escape wiring lines in the plan view.Type: ApplicationFiled: February 22, 2021Publication date: August 25, 2022Inventors: Charles Leon Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas Edward Lombardi, SHIDONG LI, Mark William Kapfhammer
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Patent number: 6272957Abstract: Disclosed is a flex die punching apparatus for forming an aperture in at least one sheet of material. There is a flexible, extrudable platen which, upon exertion of a force against it, extrudes at least a portion of at least one sheet of material through an aperture of a die. The flexible, extrudable platen may have a punch feature, corresponding to the shape and position of the die aperture, which assists in the extruding of the flexible, extrudable platen through the die aperture and also in the formation of the aperture in the sheet of material. In another embodiment of the invention, there may be a second die wherein the at least one sheet of material is placed between the first and second dies to form the aperture in the sheet of material.Type: GrantFiled: September 8, 2000Date of Patent: August 14, 2001Assignee: International Business Machines CorporationInventors: William Dale Carbaugh, Jr., Lester Wynn Herron, Mark William Kapfhammer, Mark Joseph LaPlante, David Clifford Long, Nabil Amir Rizk, James Robert Wylder
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Patent number: 6207330Abstract: Exposure masks and inspection masks for use in the electronics field may be made using laser beams wherein the mask comprises a substrate which is substantially unaffected by exposure to the laser beam and an opaque pattern forming layer on the substrate, which pattern forming layer absorbs the laser beam and is selectively etched when exposed to the laser beam. A preferred mask has an overcoat transparent layer. A cavity inspection mask is provided having a series of openings in the form of lines formed in the opaque pattern forming layer, the lines bounding the cavity walls, is the mask being used for determining if the cavity is centrally positioned on the substrate and/or that the cavity is of the desired size. Substrates containing identifying masks thereon which cannot be seen by the unaided eye for theft deterrence are also provided.Type: GrantFiled: March 30, 1999Date of Patent: March 27, 2001Assignee: International Business Machines CorporationInventors: James Gregory Balz, Mark William Kapfhammer, Mark Joseph LaPlante, David C. Long
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Patent number: 6127069Abstract: Exposure masks and inspection masks for use in the electronics field may be made using laser beams wherein the mask comprises a substrate which is substantially unaffected by exposure to the laser beam and an opaque pattern forming layer on the substrate, which pattern forming layer absorbs the laser beam and is selectively etched when exposed to the laser beam. A preferred mask has an overcoat transparent layer. A cavity inspection mask is provided having a series of openings in the form of lines formed in the opaque pattern forming layer, the lines bounding the cavity walls, is the mask being used for determining if the cavity is centrally positioned on the substrate and/or that the cavity is of the desired size. Substrates containing identifying masks thereon which cannot be seen by the unaided eye for theft deterrence are also provided.Type: GrantFiled: October 20, 1998Date of Patent: October 3, 2000Assignee: International Business Machines CorporationInventors: James Gregory Balz, Mark William Kapfhammer, Mark Joseph LaPlante, David C. Long
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Patent number: 6116127Abstract: Disclosed is a flex die punching apparatus for forming an aperture in at least one sheet of material. There is a flexible, extrudable platen which, upon exertion of a force against it, extrudes at least a portion of at least one sheet of material through an aperture of a die. The flexible, extrudable platen may have a punch feature, corresponding to the shape and position of the die aperture, which assists in the extruding of the flexible, extrudable platen through the die aperture and also in the formation of the aperture in the sheet of material. In another embodiment of the invention, there may be a second die wherein the at least one sheet of material is placed between the first and second dies to form the aperture in the sheet of material.Type: GrantFiled: July 15, 1999Date of Patent: September 12, 2000Assignee: International Business Machines CorporationInventors: William Dale Carbaugh, Jr., Lester Wynn Herron, Mark William Kapfhammer, Mark Joseph LaPlante, David Clifford Long, Nabil Amir Rizk, James Robert Wylder
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Patent number: 5974931Abstract: Disclosed is a flex die punching apparatus for forming an aperture in at least one sheet of material. There is a flexible, extrudable platen which, upon exertion of a force against it, extrudes at least a portion of at least one sheet of material through an aperture of a die. The flexible, extrudable platen may have a punch feature, corresponding to the shape and position of the die aperture, which assists in the extruding of the flexible, extrudable platen through the die aperture and also in the formation of the aperture in the sheet of material. In another embodiment of the invention, there may be a second die wherein the at least one sheet of material is placed between the first and second dies to form the aperture in the sheet of material.Type: GrantFiled: July 7, 1997Date of Patent: November 2, 1999Assignee: International Business Machines CorporationInventors: William Dale Carbaugh, Jr., Lester Wynn Herron, Mark William Kapfhammer, Mark Joseph LaPlante, David Clifford Long, Nabil Amir Rizk, James Robert Wylder
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Patent number: 5958628Abstract: Exposure masks and inspection masks for use in the electronics field may be made using laser beams wherein the mask comprises a substrate which is substantially unaffected by exposure to the laser beam and an opaque pattern forming layer on the substrate, which pattern forming layer absorbs the laser beam and is selectively etched when exposed to the laser beam. A preferred mask has an overcoat transparent layer. A cavity inspection mask is provided having a series of openings in the form of lines formed in the opaque pattern forming layer, the lines bounding the cavity walls, is the mask being used for determining if the cavity is centrally positioned on the substrate and/or that the cavity is of the desired size. Substrates containing identifying masks thereon which cannot be seen by the unaided eye for theft deterrence are also provided.Type: GrantFiled: July 14, 1997Date of Patent: September 28, 1999Assignee: International Business Machines CorporationInventors: James Gregory Balz, Mark William Kapfhammer, Mark Joseph LaPlante, David C. Long