Abstract: An instrument comprises a substrate, a plurality of sensors distributed at positions across the substrate's surface, at least one electronic processing component on the surface, electrical conductors extending across the surface and connected to the sensors and processing component, and a cover disposed over the sensors, processing component and conductors. The cover and substrate have similar material properties to a production substrate. The cover is configured to electromagnetically shield the sensors, conductors, or processing component. The instrument has approximately the same thickness and/or flatness as the production substrate. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

Abstract: A method for reducing overlay error in a photolithographic process, by providing a substrate having a permanent layer with a first pattern disposed therein, coating the substrate with photoresist, exposing the photoresist to a second pattern, while measuring temperatures at a plurality of different first positions across the substrate, developing the second pattern in the photoresist, measuring overlay errors between the first and second patterns at a plurality of different second positions across the substrate, correlating the overlay errors with temperatures by position on the substrate, determining any relationship indicated between the correlated overlay errors and temperatures, and adjusting at least one temperature controlling aspect of the photolithographic process in response to any relationship determined.

Abstract: An electrical adapter is provided for engaging a connector plug. The adapter comprises a male end, a female end, and a retention member. The male end is disposed at one end of the adapter for connecting the adapter to a female receptacle corresponding to the connector plug. The female end is disposed at another end of the adapter for engaging the connector plug. The female end comprises a top cap having a button disposed thereon. The retention member comprises a holder section, an energy storage section, and an energy release section. The holder section holds the connector plug. The energy storage section stores energy resulting from when the connector plug engages the retention member. When engaged by the button, the energy release section releases the energy stored in the energy storage section such that the connector plug automatically ejects from the adapter.

Abstract: An electrical adapter is provided for engaging a connector plug. The adapter comprises a male end, a female end, and a retention member. The male end is disposed at one end of the adapter for connecting the adapter to a female receptacle corresponding to the connector plug. The female end is disposed at another end of the adapter for engaging the connector plug. The female end comprises a top cap having a button disposed thereon. The retention member comprises a holder section, an energy storage section, and an energy release section. The holder section holds the connector plug. The energy storage section stores energy resulting from when the connector plug engages the retention member. When engaged by the button, the energy release section releases the energy stored in the energy storage section such that the connector plug automatically ejects from the adapter.

Abstract: A corrosion barrier is provided, disposed on a substrate. The corrosion barrier includes a vapor corrosion inhibitor (VCI) material and an anti-wetting barrier having a nano-particle composite structure.

Abstract: An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

Abstract: A method for reducing overlay error in a photolithographic process, by providing a substrate having a permanent layer with a first pattern disposed therein, coating the substrate with photoresist, exposing the photoresist to a second pattern, while measuring temperatures at a plurality of different first positions across the substrate, developing the second pattern in the photoresist, measuring overlay errors between the first and second patterns at a plurality of different second positions across the substrate, correlating the overlay errors with temperatures by position on the substrate, determining any relationship indicated between the correlated overlay errors and temperatures, and adjusting at least one temperature controlling aspect of the photolithographic process in response to any relationship determined.

Abstract: A Stylus Having Variable Reflectivity and Method for Data Input Therewith is disclosed. The stylus has a reflective portion attached to it that will reflect incident light in response to user actuation. The system with which the stylus is configured to cooperate will receive reflected incident light and interpret it as a “mouse click” special data input. The user actuation can be provided in a variety of different fashions, depending upon the configuration of the particular stylus, including tip-touch-activated, as well as touching a pad disposed on the body of the stylus. The responsively reflective portion is locatable at the tip of the stylus or at other locations on the body of the stylus.

Abstract: A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.

Abstract: Apparatus for measuring wafer support pedestal temperature in a semiconductor wafer processing system. The apparatus measures infrared energy emitted by the bottom of the pedestal via a tube having one end inserted in a bore through the underside of the cathode pedestal base. The distal end of the tube is coupled to a temperature sensor. Both the tube and temperature sensor are fitted with insulating sleeve adapters to suppress unwanted RF signals from coupling to the sensor.

Abstract: An etchant composition of nitrogen trifluoride and chlorine, preferably also including a passivation material such as hydrogen bromide, etches tungsten silicide-polysilicon gate layers with high selectivity to a thin underlying silicon oxide gate oxide layer to form straight wall, perpendicular profiles with low microloading and excellent profile control.