Abstract: The invention relates to an apparatus for generating light, comprising a plurality of light sources (1), —a control device (2), which drives the light sources (1), and a superimposition optical unit, which superimposes the light emitted by the light sources (1) in an exit opening (3). It is an object of the invention to provide an apparatus which is improved compared with the prior art. For this purpose, the invention proposes that the superimposition optical unit comprises a first concave mirror (4), in the focal plane of which the light sources (1) are situated, an optical grating (5), onto which the first concave mirror (4) reflects the light (6) emitted by the light sources (1), and —a second concave mirror (7), which reflects the light (8) diffracted at the optical grating (5) onto the exit opening (3) situated at the focus of the second concave mirror (7).

Abstract: The invention relates to an apparatus for generating light, comprising a plurality of light sources (1), —a control device (2), which drives the light sources (1), and a superimposition optical unit, which superimposes the light emitted by the light sources (1) in an exit opening (3). It is an object of the invention to provide an apparatus which is improved compared with the prior art. For this purpose, the invention proposes that the superimposition optical unit comprises a first concave mirror (4), in the focal plane of which the light sources (1) are situated, an optical grating (5), onto which the first concave mirror (4) reflects the light (6) emitted by the light sources (1), and —a second concave mirror (7), which reflects the light (8) diffracted at the optical grating (5) onto the exit opening (3) situated at the focus of the second concave mirror (7).

Abstract: A method of inspecting a bonded wafer 3 arrangement comprises: directing measuring radiation through the bonded wafer arrangement 3; imaging at least a portion of the bonded wafer arrangement onto a detector 19 using the measuring radiation having traversed the bonded wafer arrangement, wherein an object side numerical aperture ? of the imaging 16, 18 is less than 0.05; and simultaneously detecting, using the detector 19, at least a portion of the measuring radiation having traversed the bonded wafer arrangement at a multitude of different spaced apart locations 23 within the field of view; wherein the detected radiation has an intensity spectrum such that an intensity of the detected radiation having wavelengths less than 700 nm is less than 10% of a total intensity of the detected radiation and an intensity of the detected radiation having wavelengths greater than 1200 nm is less than 10% of the total intensity of the detected radiation.

Abstract: A method of inspecting a bonded wafer 3 arrangement comprises: directing measuring radiation through the bonded wafer arrangement 3; imaging at least a portion of the bonded wafer arrangement onto a detector 19 using the measuring radiation having traversed the bonded wafer arrangement, wherein an object side numerical aperture ? of the imaging 16, 18 is less than 0.05; and simultaneously detecting, using the detector 19, at least a portion of the measuring radiation having traversed the bonded wafer arrangement at a multitude of different spaced apart locations 23 within the field of view; wherein the detected radiation has an intensity spectrum such that an intensity of the detected radiation having wavelengths less than 700 nm is less than 10% of a total intensity of the detected radiation and an intensity of the detected radiation having wavelengths greater than 1200 nm is less than 10% of the total intensity of the detected radiation.

Abstract: A method serves for the determination of the 3D coordinates of an object (2). A fringe pattern is projected onto the object (2) in the method. The light reflected by the object (2) is recorded and evaluated. To improve such a method, the fringe pattern is projected onto the object (2) by an imaging element (only FIGURE).

Abstract: A method serves for the determination of the 3D coordinates of an object (2). A fringe pattern is projected onto the object (2) in the method. The light reflected by the object (2) is recorded and evaluated. To improve such a method, the fringe pattern is projected onto the object (2) by an imaging element (only FIGURE).