Patents by Inventor Markus Foerste

Markus Foerste has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9281301
    Abstract: An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: March 8, 2016
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stephan Haslbeck, Markus Foerste, Michael Schwind, Martin Haushalter, Hubert Halbritter, Frank Möllmer
  • Publication number: 20140191253
    Abstract: An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.
    Type: Application
    Filed: May 19, 2011
    Publication date: July 10, 2014
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Stephan Haslbeck, Markus Foerste, Michael Schwind, Martin Haushalter, Hubert Halbritter, Frank Möllmer
  • Patent number: 8759862
    Abstract: An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: June 24, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: David O'Brien, Martin Haushalter, Markus Foerste, Frank Möllmer
  • Publication number: 20130200411
    Abstract: An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.
    Type: Application
    Filed: May 24, 2011
    Publication date: August 8, 2013
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: David O'Brien, Martin Haushalter, Markus Foerste, Frank Möllmer