Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

Abstract: A radar semiconductor chip includes a radar circuit component configured to generate at least part of a frequency-modulated ramp signal or process at least part of a reflected frequency-modulated ramp signal according to a control parameter; a memory configured to store a sequencing program associated with regulating the control parameter, wherein the sequencing program specifies a first data source, external to the sequencing program, that is configured to provide a first data value corresponding to the control parameter; and a decoder configured to read the sequencing program, access the first data value from the first data source specified by the sequencing program, derive a first control value for the control parameter from the first data value, and provide the first control value to the radar circuit component. The radar circuit component regulates a controlled circuit function in accordance with the control parameter based on the first control value.

Abstract: A method is proposed for determining at least one calibration parameter for a radar system having a first radar transceiver and a second radar transceiver. The method includes performing a first calibration measurement and a second calibration measurement. The first calibration measurement and the second calibration measurement both include generating a first frequency-modulated oscillation signal and a second frequency-modulated oscillation signal, and combining the first oscillation signal received via the second terminal with the second oscillation signal, in order to generate a first difference signal for the first calibration measurement and a second difference signal for the second calibration measurement, both having a frequency difference between the first oscillation signal and the second oscillation signal.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: The present disclosure relates to a transmission apparatus, including at least one first RF signal connection for an RF signal having a first phase, a ring coupler having a plurality of antenna connections for coupling a plurality of antennas in the first RF signal connection, wherein the ring coupler is configured to cause, at each of different antenna connections of the ring coupler, a constructive superposition of components of the RF signal that propagate from the first RF signal connection to the respective antenna connections in different directions in the ring coupler, wherein RF signals having different phases are obtained at the different antenna connections.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: A method is proposed for determining at least one calibration parameter for a radar system having a first radar transceiver and a second radar transceiver. The method includes performing a first calibration measurement and a second calibration measurement. The first calibration measurement and the second calibration measurement both include generating a first frequency-modulated oscillation signal and a second frequency-modulated oscillation signal, and combining the first oscillation signal received via the second terminal with the second oscillation signal, in order to generate a first difference signal for the first calibration measurement and a second difference signal for the second calibration measurement, both having a frequency difference between the first oscillation signal and the second oscillation signal.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

Abstract: The present disclosure relates to a transmission apparatus, including at least one first RF signal connection for an RF signal having a first phase, a ring coupler having a plurality of antenna connections for coupling a plurality of antennas in the first RF signal connection, wherein the ring coupler is configured to cause, at each of different antenna connections of the ring coupler, a constructive superposition of components of the RF signal that propagate from the first RF signal connection to the respective antenna connections in different directions in the ring coupler, wherein RF signals having different phases are obtained at the different antenna connections.