Patents by Inventor Markus Juch Heinrici

Markus Juch Heinrici has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
    Patent number: 9673096
    Abstract: According to various embodiments, a method for processing a semiconductor substrate may include: covering a plurality of die regions of the semiconductor substrate with a metal; forming a plurality of dies from the semiconductor substrate, wherein each die of the plurality of dies is covered with the metal; and, subsequently, annealing the metal covering at least one die of the plurality of dies.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: June 6, 2017
    Assignees: INFINEON TECHNOLOGIES AG, Technische Universitaet Graz
    Inventors: Joachim Hirschler, Michael Roesner, Markus Juch Heinrici, Gudrun Stranzl, Martin Mischitz, Martin Zgaga