Abstract: A PTC heating element for an electric heater having a PTC element, an electrode formed on a surface of the PTC element for electrically contacting the PTC element, at least one additional contact for electrically connecting the electrode of the PTC element, and a carrier layer. The carrier layer is electrically insulating, the thickness of the PTC element is ?500 ?m, and the installation height of the PTC heating element is between 500 ?m and 2500 ?m. Also disclosed is an electric heater and use of the PTC heating element in a motor vehicle.

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.

Abstract: A cooling system for a semiconductor device. The system includes a first heat sink containing a ceramic material as a main component and a semiconductor device having a first contact surface. The first heat sink serves for cooling the semiconductor device and as an electrical insulator with respect to the semiconductor device. Furthermore, a first metal-containing layer is provided on at least one outer surface of the first heat sink, the first metal-containing layer having a size at least equal to the area of the first contact surface of the semiconductor device. The semiconductor device is attached to the first metal-containing layer via the contact surface by a first bonding layer formed by soldering or sintering.

Abstract: A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.

Abstract: An electrical component having partial bodies, a base on which the partial bodies are arranged, and at least one connection contact for electrically connecting the partial bodies to a carrier. A method for producing an electrical component having one or more partial bodies is also disclosed.

Abstract: A module having a power semiconductor device and a ceramic capacitor which is configured for cooling the power semiconductor device.

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.

Abstract: A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.

Abstract: A filter component for filtering an interference signal comprises at least one multilayer ceramic capacitor (2, 3, 5) having a main body (6), in which a plurality of ceramic layers (9) and internal electrodes (10, 11, 12) are stacked one above another, and wherein connection contacts (7, 8) are arranged at the main body (6). The ceramic layers (9) comprise a lead lanthanum zirconate titanate ceramic, for example.

Abstract: The present invention relates to a capacitor assembly (1) which comprises at least one ceramic multilayer capacitor (2) comprising ceramic layers (4) and first and second electrodes (5a, 5b) arranged therebetween, and a base (3). The base (3) comprises a substrate (9) and conductor tracks (10a, 10b), wherein the conductor tracks (10a, 10b) lead from a top side (11) of the substrate (9) said top side facing toward the multilayer capacitor (2), to an underside (12) of the substrate (9), said underside facing away from the multilayer capacitor (2). The multilayer capacitor (2) is mechanically secured on the base (3). The first electrodes (5a) and the second electrodes (5c) are electrically contacted with the conductor tracks (10a, 10b).

Abstract: A filter component for filtering an interference signal. The filter component includes at least one multilayer ceramic capacitor having a main body, in which multiple ceramic layers and internal electrodes are stacked one above another, and connection contacts are arranged at the main body. The ceramic layers include a lead lanthanum zirconate titanate ceramic, for example.

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

Abstract: A filter component for filtering an interference signal. The filter component includes at least one multilayer ceramic capacitor having a main body, in which multiple ceramic layers and internal electrodes are stacked one above another, and connection contacts are arranged at the main body. The ceramic layers include a lead lanthanum zirconate titanate ceramic, for example.

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

Abstract: The present invention relates to a capacitor assembly (1) which comprises at least one ceramic multilayer capacitor (2) comprising ceramic layers (4) and first and second electrodes (5a, 5b) arranged therebetween, and a base (3). The base (3) comprises a substrate (9) and conductor tracks (10a, 10b), wherein the conductor tracks (10a, 10b) lead from a top side (11) of the substrate (9) said top side facing toward the multilayer capacitor (2), to an underside (12) of the substrate (9), said underside facing away from the multilayer capacitor (2). The multilayer capacitor (2) is mechanically secured on the base (3). The first electrodes (5a) and the second electrodes (5c) are electrically contacted with the conductor tracks (10a, 10b).

Abstract: The present invention relates to a module (1) which comprises a power semiconductor device (2) and a ceramic capacitor (3) which is configured for cooling the power semiconductor device (2).

Abstract: A ceramic material for capacitors using multilayer technology of formula (I): Pb(1?1.5a)AaBb(Zr1?xTix)(1?c?d?e?f)CeSicO3+y·PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; C is selected from the group consisting of Ni and Cu; and 0<a<0.12, 0.05?x?0.3, 0?c<0.12, 0.001<e<0.12 and 0?y<1.

Abstract: The invention specifies an electrical component (1) which has a plurality of partial bodies (2), a base (3) on which the partial bodies (2) are arranged, and at least one connection contact (4, 5) for electrically connecting the partial bodies (2) to a carrier (13). The invention further specifies a method for producing an electrical component (1) having one or more partial bodies (2).

Abstract: A capacitor arrangement is disclosed. In an embodiment the arrangement includes a ceramic multilayer capacitor including a main body comprising ceramic layers, first electrode layers and second electrode layers arranged there between and a first external contact and a second external contact on mutually opposite side surfaces, wherein the first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers.