Abstract: The current disclosure describes a stereo imaging system that is configured to use Time-of-Flight (“Tof”) techniques to aid in stereoscopic image processing. One process disclosed uses ToF to aid in identifying the same elements (e.g., pixel clusters) in stereo image pairs by narrowing down search areas for matching. Another process uses ToF to aid in identifying the same elements in stereo image pairs where there a small amount texture making it difficult to find a match.

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

Abstract: Structured light projection system includes an array of light emitting devices, which is configured to emit a pattern of light. A projection lens is configured to receive and project the pattern of light from the array to a first optical element. The first optical element alters the pattern of light to generate a first emitted pattern of light that is irregular. The first emitted pattern of light is transmitted to a second optical element that is configured to receive the first pattern of light and reproduce the first emitted pattern along a second emitted pattern, which comprises multiple instances of the first emitted pattern arranged in a tiled pattern.

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Abstract: Optoelectronic modules operable to measure proximity independent of object surface reflectivity and, in some implementations, operable to measure characteristics (such as surface reflectivity or absorptivity) of stationary or moving objects are disclosed. The optoelectronic modules are operable to determine, for example, pulse rate, peripheral blood circulation, and/or blood oxygen levels of moving objects, such as the appendage of a user, in some instances. The optoelectronic modules can be used to measure peripheral blood circulation, for example, when a user of the optoelectronic module is engaged in physical activity, such as walking, running or cycling.

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Abstract: A structured light projection system includes an array of light emitting elements operable, collectively, to emit a regular pattern of light. A first optical element is configured to alter the pattern of light emitted by the array of light emitting elements to generate a first irregular pattern of light, and a second optical element is configured to receive the irregular pattern of light generated by the first optical element and to produce a pattern comprising multiple instances of the first irregular pattern.

Abstract: This disclosure describes illumination assemblies operable to generate a patterned illumination that maintain high contrast over a wide temperature range. An implementation of the illumination assembly can include an array of monochromatic light sources positioned on an illumination plane, first and second optical elements, and an exit aperture. A chief ray of each light source within the array of monochromatic light sources can substantially converge at an exit aperture. In such implementations light generated by the array of monochromatic light sources can be used efficiently.

Abstract: An optoelectronic system for collecting three-dimensional data of a scene over a minimum and maximum distance includes illumination modules, each of which is operable to generate a respective light pattern having a respective period. An imaging module is operable to collect a scene-reflected portion of each of the light patterns and is further operable to convert each collected portion into a respective signal set. Each scene-reflected portion is characterized by a respective plurality of ambiguity values and a minimum disparity value, and wherein each signal set corresponds to a respective one of the light patterns. The system includes a processor, and a non-transitory computer-readable medium comprising instructions stored thereon that, when executed by the processor, cause the processor to perform operations for determining a plurality of candidate three-dimensional data sets. Each candidate three-dimensional data set is determined from a respective one of the signal sets.

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Abstract: This disclosure describes illumination assemblies operable to generate a patterned illumination that maintain high contrast over a wide temperature range. An implementation of the illumination assembly can include an array of monochromatic light sources positioned on an illumination plane, first and second optical elements, and an exit aperture. A chief ray of each light source within the array of monochromatic light sources can substantially converge at an exit aperture. In such implementations light generated by the array of monochromatic light sources can be used efficiently.

Abstract: This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Abstract: The opto-electronic module comprises a first substrate member; a second substrate member; a first spacer member comprised in the first substrate member or comprised in the second substrate member or distinct from and located between these, which comprises at least one opening; a light emission element arranged on the first substrate member; a first passive optical component; at least one of the first and second substrate members comprising one or more transparent portions through which light can pass, the first passive optical component being comprised in or distinct from the one or more transparent portions, and wherein the first passive optical component has adjustable optical properties. Such modules are well mass-producible in high precision and can be used in photo cameras, e.g., as flashes.

Abstract: Structured light projection system includes an array of light emitting devices, which is configured to emit a pattern of light. A projection lens is configured to receive and project the pattern of light from the array to a first optical element. The first optical element alters the pattern of light to generate a first emitted pattern of light that is irregular. The first emitted pattern of light is transmitted to a second optical element that is configured to receive the first pattern of light and reproduce the first emitted pattern along a second emitted pattern, which comprises multiple instances of the first emitted pattern arranged in a tiled pattern.

Abstract: Compact spectrometer modules include an illumination channel and a detection channel. The illumination channel includes an illumination source operable to generate a broad spectrum of electromagnetic radiation. The detection channel includes an illumination detector and a Fabry-Perot component. The Fabry-Perot component is operable to pass a narrow spectrum of wavelengths to the illumination detector. Further, the Fabry-Perot component can be actuatable such that the Fabry- Perot component is operable to pass a plurality of narrow spectrums of wavelengths to the illumination detector.

Abstract: This disclosure describes optical assemblies that generate output with substantial stability over a wide variation in temperature. The optical assemblies can be integrated, for example, as part of array generators arranged to project an array or other pattern of dots onto an object or projection plane.

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract: An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).

Abstract: A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.