Abstract: Methods, kits, and systems using machine-readable labels are disclosed to assist in communications between the material provider and the end-user of a graphic film product, especially when the end-user does not acquire the graphic film product directly from the material, where such communications may relate to the warranty for the graphic film product.

Abstract: An apparatus is provided which comprises: a cavity made in a substrate of a printed circuit board (PCB); a plurality of solder balls embedded in the cavity; and a horizontal trace within the substrate, wherein the horizontal trace is partially directly under the plurality of solder balls and is coupled to the plurality of solder balls and another trace or via in the substrate such that a substrate region under the plurality of solder balls is independent of a stop layer under the cavity.

Abstract: An apparatus is provided which comprises: a cavity made in a substrate of a printed circuit board (PCB); a plurality of solder balls embedded in the cavity; and a horizontal trace within the substrate, wherein the horizontal trace is partially directly under the plurality of solder balls and is coupled to the plurality of solder balls and another trace or via in the substrate such that a substrate region under the plurality of solder balls is independent of a stop layer under the cavity.

Abstract: An apparatus is provided which comprises: a cavity made in a substrate of a printed circuit board (PCB); a plurality of solder balls embedded in the cavity; and a horizontal trace within the substrate, wherein the horizontal trace is partially directly under the plurality of solder balls and is coupled to the plurality of solder balls and another trace or via in the substrate such that a substrate region under the plurality of solder balls is independent of a stop layer under the cavity.

Abstract: Techniques and mechanisms for efficiently providing reliable connection through a substrate such as that of a core of a packaged integrated circuit device. In an embodiment, a substrate has formed therein a through-hole interconnects, wherein an insulator is disposed between the through-hole interconnects in the substrate. A redundant configuration of the through-hole interconnects with respect to each other allows for a higher tolerance of voids being formed in the through-hole interconnects. In another embodiment, the through-hole interconnects are shorted together at one side of the substrate, and are further shorted together at an opposite side of the substrate. A total volume of any voids formed by one of the through-hole interconnects is equal to or more than six thousand cubic micrometers.