Abstract: A pin plate used to print a high density array printing of materials such as biological inks and a method for manufacturing the pin plate are described herein. The pin plate can be manufactured by coating a top surface of a silica wafer with a substantially thick layer of photoresist material. Next, a photolithography process is used to remove selected areas of the photoresist material from the silica wafer. Thereafter, a reactive ion etching process is used to form the pins in the silica wafer by etching away a predetermined amount of the top surface from the silica wafer that is not covered by the photoresist material. Afterwards, the remaining photoresist material is removed from the silica wafer which now resembles the pin plate.

Abstract: A method for fabricating optical devices for transmission and/or manipulation of light includes steps of providing a substrate which defines a reference plane for positioning cladding material and core material, fixing rigid spacers to an upper surface of the substrate, the spacers having upper surfaces which define a second plane spaced above the reference plane, depositing a layer of a formable, curable under-cladding material over the upper surface of the substrate, the upper surface of the rigid spacers providing a guide for precise control of the height of the under-cladding material above the surface of the substrate, curing the under-cladding material under compression to form an under-cladding layer, and depositing a light guide core and over-cladding on the under-cladding. The method is susceptible to mass production and provides more precise control of the position of the light guide core relative to a substrate surface.