Abstract: A system for interfacing between a semiconductor wafer, an automatic wafer probe machine, and an automatic IC test system includes an insert ring adapted for attachment to a support of the wafer probe machines. A lock ring assembly includes a lock ring rotatably disposed in the insert ring. A cam element having a sloped camming surface is attached to the lock ring. A retaining element attached to the insert ring retains the lock ring in the insert ring. A lid hingeably attached to the insert ring supports a POGO tower assembly including an adapter ring for attachment to a POGO tower and a z-axis ring attached to the adapter ring, and a mounting assembly connecting the z-axis ring in spring-loaded relationship to the lid. A cam follower attached to the z-axis ring engages the sloped camming surface when the lid is lowered to position a bottom surface of the POGO tower slightly above the probe card.