Abstract: A formulation for depositing a material on a substrate, the formulation comprising the material to be deposited on the substrate dissolved in a solvent system comprising a first solvent component having a relatively high boiling point and which exhibits a relatively low solubility with respect to the material to be deposited, and a second solvent component having a relatively low boiling point and which exhibits a relatively high solubility with respect to the material to be deposited.

Abstract: A formulation for depositing a material on a substrate, the formulation comprising the material to be deposited on the substrate dissolved in a solvent system comprising a first solvent component having a relatively high boiling point and which exhibits a relatively low solubility with respect to the material to be deposited, and a second solvent component having a relatively low boiling point and which exhibits a relatively high solubility with respect to the material to be deposited.

Abstract: A method of fabricating a molecular electronic device, the method comprising: fabricating a substrate having a plurality of banks defining wells for the deposition of molecular material; and depositing molecular electronic material into said wells, dissolved in a solvent, using a droplet deposition technique, to fabricate said device; wherein a said bank has a face, defining an edge of said well, at an angle to a base of the well of greater than a contact angle of said solvent with said bank face; and wherein a height of a said bank above a said base of a said well is less than 2 ?m, and more preferably less than 1.5 ?m.

Abstract: A method for preparing an organic electronic or optoelectronic device is described. The method comprises depositing a layer of fluorinated polymer on a substrate, patterning the layer of fluorinated polymer to form a relief pattern and depositing from solution a layer of organic semiconductive or conductive material on the substrate. The fluorinated polymer may be a fluorinated photoresist and may be treated by exposure to ultraviolet light and ozone prior to the deposition of the layer of organic semiconductive or conductive material. The method has particular application in the preparation of organic light emitting devices by ink-jet printing.

Abstract: A formulation for depositing a material on a substrate, the formulation comprising the material to be deposited on the substrate dissolved in a solvent system comprising a first solvent component having a relatively high boiling point and which exhibits a relatively low solubility with respect to the material to be deposited, and a second solvent component having a relatively low boiling point and which exhibits a relatively high solubility with respect to the material to be deposited.

Abstract: A method for preparing an organic electronic or optoelectronic device is described. The method comprises depositing a layer of fluorinated polymer on a substrate, patterning the layer of fluorinated polymer to form a relief pattern and depositing from solution a layer of organic semiconductive or conductive material on the substrate. The fluorinated polymer may be a fluorinated photoresist and may be treated by exposure to ultraviolet light and ozone prior to the deposition of the layer of organic semiconductive or conductive material. The method has particular application in the preparation of organic light emitting devices by ink-jet printing.

Abstract: A formulation for depositing a material on a substrate, the formulation comprising the material to be deposited on the substrate dissolved in a solvent system comprising a first solvent component having a relatively high boiling point and which exhibits a relatively low solubility with respect to the material to be deposited, and a second solvent component having a relatively low boiling point and which exhibits a relatively high solubility with respect to the material to be deposited.