Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: Among other things, an anti-scatter collimator (200) includes a first anti-scatter structure (302) defining a retaining member (432). The retaining member includes a first protruding member having a top surface defining a first plane, and a second protruding member having a second top surface defining a second plane. The second protruding member is spaced apart from the first protruding member to define a groove (434). The retaining member includes a support member extending between the first protruding member and the second protruding member. The support member defines a bottom surface of the groove. The bottom surface of the support member is spaced a distance apart from the first plane and the second plane. A second anti-scatter structure (303) includes a septum disposed within the groove. The first protruding member, the second protruding member, and the support member maintain a position of the septum relative to the first anti-scatter structure.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: A dual-energy detector array for a radiation system is provided. The dual-energy detector array includes a circuit board assembly having a first side and a second side. A first conversion package is coupled to the first side of the circuit board assembly and has a first effective photon energy. A second conversion package is coupled to the second side of the circuit board assembly and has a second effective photon energy different than the first effective photon energy. A radiation filtering material is disposed within the circuit board assembly between the first conversion package and the second conversion package. The radiation filtering material attenuates at least some of the radiation photons impinging thereon.

Abstract: Among other things, an anti-scatter collimator (200) includes a first anti-scatter structure (302) defining a retaining member (432). The retaining member includes a first protruding member having a top surface defining a first plane, and a second protruding member having a second top surface defining a second plane. The second protruding member is spaced apart from the first protruding member to define a groove (434). The retaining member includes a support member extending between the first protruding member and the second protruding member. The support member defines a bottom surface of the groove. The bottom surface of the support member is spaced a distance apart from the first plane and the second plane. A second anti-scatter structure (303) includes a septum disposed within the groove. The first protruding member, the second protruding member, and the support member maintain a position of the septum relative to the first anti-scatter structure.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: A dual-energy detector array for a radiation system is provided. The dual-energy detector array includes a circuit board assembly having a first side and a second side. A first conversion package is coupled to the first side of the circuit board assembly and has a first effective photon energy. A second conversion package is coupled to the second side of the circuit board assembly and has a second effective photon energy different than the first effective photon energy. A radiation filtering material is disposed within the circuit board assembly between the first conversion package and the second conversion package. The radiation filtering material attenuates at least some of the radiation photons impinging thereon.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Abstract: One or more techniques and/or systems described herein implement, among other things, a parabolic curve for a ramp signal in a data acquisition component, where the curve can be effectively calibrated and used to provide a settling period to mitigate noise. That is, a ramp generator can generate a ramp signal that has a parabolic voltage curve with two substantially mirroring halves. A comparator can compare a first portion of the parabolic voltage curve with a voltage signal indicative of a number of photons detected by a detection array. A second portion of the parabolic voltage curve is used as a temporal delay so that circuitry, such as the ramp generator, can settle.

Abstract: Among other things, one or more tiles for an indirect-conversation radiation detector array are provided herein. Respective tiles comprise a detector sub-assembly and an electronic sub-assembly, which are operably coupled together, yet selectively removable, via a connection interface. When an electronic sub-assembly portion of a tile, which comprises a signal acquisition system (e.g., an integrated circuit, such as an application specific integrated circuit (ASIC)), functions improperly, the electronic sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the detector sub-assembly (e.g., which may be much more costly to replace). Similarly, when the detector sub-assembly portion of a tile functions improperly, the detector sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the electronic sub-assembly portion of the tile (e.g.

Abstract: Among other things, one or more tiles for an indirect-conversation radiation detector array are provided herein. Respective tiles comprise a detector sub-assembly and an electronic sub-assembly, which are operably coupled together, yet selectively removable, via a connection interface. When an electronic sub-assembly portion of a tile, which comprises a signal acquisition system (e.g., an integrated circuit, such as an application specific integrated circuit (ASIC)), functions improperly, the electronic sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the detector sub-assembly (e.g., which may be much more costly to replace). Similarly, when the detector sub-assembly portion of a tile functions improperly, the detector sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the electronic sub-assembly portion of the tile (e.g.

Abstract: One or more techniques and/or systems described herein implement, among other things, a parabolic curve for a ramp signal in a data acquisition component, where the curve can be effectively calibrated and used to provide a settling period to mitigate noise. That is, a ramp generator can generate a ramp signal that has a parabolic voltage curve with two substantially mirroring halves. A comparator can compare a first portion of the parabolic voltage curve with a voltage signal indicative of a number of photons detected by a detection array. A second portion of the parabolic voltage curve is used as a temporal delay so that circuitry, such as the ramp generator, can settle.

Abstract: An x-ray detector assembly includes a first substrate and a second substrate. An array of photodetectors, which have coplanar contacts, are disposed on the top surface of the first substrate. The x-ray detector assembly further includes a plurality of x-ray scintillator elements arranged in an array. The photodetectors are aligned so as to match the array of x-ray scintillator elements. The second substrate is fused to the bottom surface of the first substrate. The second substrate provides on its distal side a planar connectivity pattern matched to electronics of a signal acquisition system. One or more through-hole connections traverse both substrates, and are configured to couple the contacts of the photodetectors from the top surface of the first substrate to the connectivity pattern on the distal side of the second substrate.

Abstract: An x-ray detector assembly includes a first substrate and a second substrate. An array of photodetectors, which have coplanar contacts, are disposed on the top surface of the first substrate. The x-ray detector assembly further includes a plurality of x-ray scintillator elements arranged in an array. The photodetectors are aligned so as to match the array of x-ray scintillator elements. The second substrate is fused to the bottom surface of the first substrate. The second substrate provides on its distal side a planar connectivity pattern matched to electronics of a signal acquisition system. One or more through-hole connections traverse both substrates, and are configured to couple the contacts of the photodetectors from the top surface of the first substrate to the connectivity pattern on the distal side of the second substrate.