Abstract: An electronic device comprising an RFID component which can act in an active mode and a passive mode. Preferably the electronic device is a PCB and the RFID component is at least partially located in the PCB. More preferably, the RFID component is located within the PCB. An electronic device comprising an embedded active component is disclosed. A method of exchanging information within an electronic device is disclosed comprising the steps in providing an electronic device which contains an RFID component which connect in a active and a passive mode, and a remote RFID device, and exchanging information between the RFID component and the remote RFID device.

Abstract: A seal arrangement having monitoring means and a seal portion. The monitoring means includes means for determining the integrity of the seal portion, the determining means being arranged to deliver a signal to radio frequency identification (RFID) means for producing an output signal in response to the integrity of the seal portion as determined by the means for determining. The present invention also provides a container, a pipe section, a pipeline and a closure member provided with such a seal arrangement.

Abstract: The present invention provides for a seal arrangement comprising monitoring means and a seal portion. The monitoring means comprises at least one means for determining the integrity of said seal portion, said determining means being arranged to deliver a signal to at least one radio frequency identification (RFID) means for producing an output signal in response to the integrity of the seal portion as determined by the said means for determining. The present invention also provides a container, a pipe section, a pipeline and a closure member provided with such a seal arrangement.

Abstract: Construction of printed circuit boards (PCBs) containing electromagnetic shielding and conductive tubes forming signal lines and/or waveguides. The method of construction calls for forming of grooves through layers of the PCB and coating the interior surfaces of these grooves with conductive material. These conductor-coated groove walls serve as conductive surfaces between embedded conductive surfaces on different layers. The conductive surfaces thus joined form a continuous electrically conductive surface that can be configured to act as an electromagnetic shield. Such conductive surfaces may be configured with internal conductors to act as a signal line, or without internal conductors to act as a waveguide.

Abstract: An electronic device comprising an RFID component which can act in an active mode and a passive mode. Preferably the electronic device is a PCB and the RFID component is at least partially located in the PCB. More preferably, the RFID component is located within the PCB. An electronic device comprising an embedded active component is disclosed. A method of exchanging information within an electronic device is disclosed comprising the steps in providing an electronic device which contains an RFID component which connect in a active and a passive mode, and a remote RFID device, and exchanging information between the RFID component and the remote RFID device.

Abstract: An EMI shielding structure for a printed circuit board for shielding wiring circuit traces on a plurality of circuit trace layers applied on a plurality of printed circuit board layers and electrically isolated there between by the printed circuit board layers. The EMI shielding structure has a printed circuit board multi-layer structure, characterized by: a trench having a rim about an opening of the trench at a top printed circuit board layer and said trench extending through a plurality of printed circuit board layers to a grounding plane exposing said grounding plane. Said trench having an interior wall with a conductive plating material applied over said wall and said trench having a length greater than two times a breadth of said trench and said wall vertically extends around the perimeter of the printed circuit board and said plating electrically connects to said exposed ground plane and wraps over and laterally extends from said rim forming a lip.

Abstract: Non-circular vias and methods of cutting away material in a printed circuit board (PCB) so as to form non-circular vias. Laser ablation or plasma ablation is used to remove PCB material about a centerline. This type of material removal allows lateral movement to effect non-circular patterns. Exemplary shapes are convoluted circle vias, square vias, extended/elongated vias, and trench vias. The trench vias may be micro milled to form a coaxialised structure that provides noise suppression and EMI protection, and are elongated to be even greater than three times the diameter of a circular micro-via.

Abstract: Construction of printed circuit boards (PCBs) containing electromagnetic shielding and conductive tubes forming signal lines and/or waveguides. The method of construction calls for forming of grooves through layers of the PCB and coating the interior surfaces of these grooves with conductive material. These conductor-coated groove walls serve as conductive surfaces between embedded conductive surfaces on different layers. The conductive surfaces thus joined form a continuous electrically conductive surface that can be configured to act as an electromagnetic shield. Such conductive surfaces may be configured with internal conductors to act as a signal line, or without internal conductors to act as a waveguide.