Patents by Inventor Martin Feng

Martin Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143847
    Abstract: A method, system, and computer program product are disclosed for securely orchestrating containers in a container orchestration environment. The containers comprise confidential containers running in a trusted execution environment (TEE) and standard containers running in the container orchestration environment. The containers are securely orchestrated without modifying the containers, container runtimes, and platforms, protecting sensitive data and code of the containers by restricting access to containers.
    Type: Application
    Filed: November 1, 2022
    Publication date: May 2, 2024
    Inventors: Tatsushi INAGAKI, Yohei UEDA, Moriyoshi OHARA, Petr NOVOTNY, James Robert MAGOWAN, Martin William John COCKS, Qi Feng HUO
  • Publication number: 20240117029
    Abstract: The present invention relates to bispecific anti-CCL2 antibodies binding to two different epitopes on human CCL2, pharmaceutical compositions thereof, their manufacture, and use as medicaments for the treatment of cancers, inflammatory, autoimmune and ophthalmologic diseases.
    Type: Application
    Filed: November 14, 2023
    Publication date: April 11, 2024
    Applicant: Hoffmann-La Roche Inc.
    Inventors: Jens FISCHER, Guy GEORGES, Anton JOCHNER, Gregor JORDAN, Hubert KETTENBERGER, Joerg MOELLEKEN, Tilman SCHLOTHAUER, Georg TIEFENTHALER, Valeria RUNZA, Meher MAJETY, Martin SCHAEFER, Maria VIERT, Shu FENG, Wei Shiong Adrian HO, Siok Wan GAN, Runyi Adeline LAM, Michael GERTZ
  • Publication number: 20240083993
    Abstract: The present invention relates to bispecific anti-CCL2 antibodies binding to two different epitopes on human CCL2, pharmaceutical compositions thereof, their manufacture, and use as medicaments for the treatment of cancers, inflammatory, autoimmune and ophthalmologic diseases.
    Type: Application
    Filed: June 15, 2023
    Publication date: March 14, 2024
    Applicant: Hoffmann-La Roche Inc.
    Inventors: Jens FISCHER, Guy GEORGES, Anton JOCHNER, Gregor JORDAN, Hubert KETTENBERGER, Joerg MOELLEKEN, Tilman SCHLOTHAUER, Georg TIEFENTHALER, Valeria RUNZA, Meher MAJETY, Martin SCHAEFER, Maria VIERT, Shu FENG, Wei Shiong Adrian HO, Siok Wan GAN, Runyi Adeline LAM, Michael GERTZ
  • Publication number: 20190233690
    Abstract: It is disclosed chitosan-reinforced urea-formaldehyde (UF) adhesives for bonding wood-based composites, such as plywood and particleboard, or other fibrous materials and the method of producing the adhesives. The adhesives are produced by mixing unmodified chitosan containing raw material and a urea-formaldehyde resin to produce wood composite adhesive resins.
    Type: Application
    Filed: September 18, 2017
    Publication date: August 1, 2019
    Applicant: FPInnovations
    Inventors: Xiang-Ming WANG, Dian-Qing YANG, Yaolin ZHANG, Martin FENG, Guangbo HE, Stéphan RAYMOND
  • Patent number: 9273238
    Abstract: Disclosed herein are method to modify the lignin with particular fungal species, and procedure to synthesize phenolic adhesives with the modified lignin as raw materials, and the adhesives compositions and methods for making adhesive compositions, and methods for making lingo-cellulosic composites from renewable materials. Four fungi in examples are Lenzites elegans (Spreng.) Pat. (FTK 329A), Phanerochaete cremea (Bres.) Parmasto (FTK 332A), Pycnoporellus alboluteus (Ellis & Everh.) Kotl. & Pouz. (FTK 76A) and Meruliopsis taxicola (Pers.) Bondartsev (FTK 122B). Lignin used in examples are organosolv lignin, Kraft lignin, and ammonium lignosulfonate. The present invention includes methods to (1) modify of lignin with fungi; (2) in-situ polymerize modified lignin-phenol-formaldehyde to generate bio-modified lignin-phenol-formaldehyde adhesive in liquid form, and (3) manufacture composite panels with bio-modified lignin-phenol-formaldehyde resins.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: March 1, 2016
    Inventors: Yaolin Zhang, Dian-Qing Yang, Xiang-Ming Wang, Martin Feng, Gilles Brunette
  • Publication number: 20150159061
    Abstract: Phenol-formaldehyde and lignin-phenol formaldehyde adhesive polymers with improved properties are disclosed, as well as the method of production therein. The method comprises providing at least one phenolic compound at least one formaldehyde compound, an alkali metal hydroxide, water and at least one carbon black; mixing the at least one phenolic compound, the at least one formaldehyde compound, the alkali metal hydroxide, the water and the carbon black to produce a methylolation medium at a pH of about 10 or less; maintaining the medium at a methylolation temperature to produce a methylolated medium reacting with the water predominantly; and increasing the temperature of the methylolated medium to produce the phenol-formaldehyde polymer via a condensation reaction.
    Type: Application
    Filed: February 10, 2012
    Publication date: June 11, 2015
    Inventors: Lamfeddal Kouisni, Michael Paleologou, Yaolin Zhang, Xiang-Ming Wang, Martin Feng
  • Patent number: 8974591
    Abstract: This invention describes an adhesive composition that forms the basis of a heat-resistant, fire resistant, and water resistant polyurethane adhesive suitable for applications in the manufacture of wood products, and the method of making the adhesive. The wood finger-jointed studs produced using an adhesive derived from this invention can meet or exceed the fire rating of a period of 60 minutes according to ASTM E 119 and ASTM D 7374. The heat resistance of the adhesive is a result of incorporating thermally stable aromatic polyol molecules into the polymeric structures of the wood adhesive system, which is composed of the reaction products of a poly(methylene diphenyl diisocyanate), at least one of a polyether polyol and a polyester polyol; and the aromatic polyol that is a hydroxyl phenol in a preferred embodiment. Furthermore, this novel wood adhesive system possesses high water-resistance, making it suitable for the manufacture of highly durable engineered wood products.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: March 10, 2015
    Assignee: FPInnovations
    Inventors: Jinlan Ju, Martin Feng, Xiang-Ming Wang
  • Patent number: 8816007
    Abstract: The present invention provides methods to functionalize and solubilize WCNT with a phenolic polymer such as a lignin or a PF resin followed by in-situ integration of this functionalized CNT in the presence of formaldehyde and phenol and/or lignin to generate either CNT-reinforced phenol-formaldehyde polymer or CNT-reinforced lignin-phenol-formaldehyde polymer in either liquid or powder form suitable as an adhesive in the manufacture of a lignocellulosic composite material such as OSB and plywood.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: August 26, 2014
    Assignees: FPInnovations, National Research Council of Canada
    Inventors: Yaolin Zhang, Xiang-Ming Wang, Martin Feng, Gilles Brunette, Fuyong Cheng, Benoit Simard
  • Publication number: 20140163142
    Abstract: Disclosed herein are method to modify the lignin with particular fungal species, and procedure to synthesize phenolic adhesives with the modified lignin as raw materials, and the adhesives compositions and methods for making adhesive compositions, and methods for making lingo-cellulosic composites from renewable materials. Four fungi in examples are Lenzites elegans (Spreng.) Pat. (FTK 329A), Phanerochaete cremea (Bres.) Parmasto (FTK 332A), Pycnoporellus alboluteus (Ellis & Everh.) Kotl. & Pouz. (FTK 76A) and Meruliopsis taxicola (Pers.) Bondartsev (FTK 122B). Lignin used in examples are organosolv lignin, Kraft lignin, and ammonium lignosulfonate. The present invention includes methods to (1) modify of lignin with fungi; (2) in-situ polymerize modified lignin-phenol-formaldehyde to generate bio-modified lignin-phenol-formaldehyde adhesive in liquid form, and (3) manufacture composite panels with bio-modified lignin-phenol-formaldehyde resins.
    Type: Application
    Filed: February 17, 2012
    Publication date: June 12, 2014
    Applicant: FPINNOVATIONS
    Inventors: Yaolin Zhang, Dian-Qing Wang, Xiang-Ming Wang, Martin Feng, Gilles Brunette
  • Publication number: 20120041146
    Abstract: The present invention provides methods to functionalize and solubilize WCNT with a phenolic polymer such as a lignin or a PF resin followed by in-situ integration of this functionalized CNT in the presence of formaldehyde and phenol and/or lignin to generate either CNT-reinforced phenol-formaldehyde polymer or CNT-reinforced lignin-phenol-formaldehyde polymer in either liquid or powder form suitable as an adhesive in the manufacture of a lignocellulosic composite material such as OSB and plywood.
    Type: Application
    Filed: July 27, 2011
    Publication date: February 16, 2012
    Applicants: NATIONAL RESEARCH COUNCIL OF CANADA, FPINNOVATIONS
    Inventors: Yaolin ZHANG, Xiang-Ming WANG, Martin FENG, Gilles BRUNETTE, Fuyong CHENG, Benoit SIMARD
  • Publication number: 20030221775
    Abstract: A method is provided for improving the bond strength and quality between a borate-treated wood material and a phenolic resin in a wood composite product, the method having the steps of bonding the wood material with an adhesive system comprising the resin and an additional base, the base providing a substantial increase in the alkalinity of the adhesive system over that provided by the resin, the increase sufficient to limit the bonding of borate molecules with the phenolic resin molecules to such an extent as to allow a substantially complete cross-linking of the phenolic resin molecules to occur. An adhesive system is also disclosed for use in the production of wood composite products.
    Type: Application
    Filed: May 31, 2002
    Publication date: December 4, 2003
    Inventors: Martin Feng, Axel Andersen, Paul Morris