Abstract: An OLED lighting module comprising a support (2); an OLED lighting panel (3) with an emissive side with emissive and non-emissive areas (38) and an opposite side which comprises an OLED substrate (31), an OLED light-generating unit and a circuit board (34); an opaque liner with a first section (41) that covers at least part of the non-emitting areas (38) over the OLED substrate and a second section (42) that extend past the edges of the OLED substrate on the emissive side of the OLED panel; and an opaque bezel (6) in contact with the support (20), the opaque bezel (6) covering at least part of the second section (42) of the opaque liner but not the first section (41) of the opaque liner. By covering only that portion of an opaque liner that extends past the edges of the OLED substrate with a bezel and not the OLED substrate itself, the module can be made thin.

Abstract: An OLED lighting module comprising a support (2); an OLED lighting panel (3) with an emissive side with emissive and non-emissive areas (38) and an opposite side which comprises an OLED substrate (31), an OLED light-generating unit and a circuit board (34); an opaque liner with a first section (41) that covers at least part of the non-emitting areas (38) over the OLED substrate and a second section (42) that extend past the edges of the OLED substrate on the emissive side of the OLED panel; and an opaque bezel (6) in contact with the support (20), the opaque bezel (6) covering at least part of the second section (42) of the opaque liner but not the first section (41) of the opaque liner. By covering only that portion of an opaque liner that extends past the edges of the OLED substrate with a bezel and not the OLED substrate itself, the module can be made thin.

Abstract: The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and feed means for encapsulating material connecting onto the mould cavity. The invention also relates to a method for encapsulating with encapsulating material an electronic component fixed on a carrier.