Abstract: Disclosed is a high frequency module for producing or processing radar signals for use in radar-based fill-level measuring devices. The high frequency module includes: a semiconductor component to produce or to process electrical, high frequency signals; a dielectric coupling element contacted with the semiconductor component to couple the high frequency signals as radar signals into a dielectric waveguide or in order to couple radar signals from the waveguide as electrical, high frequency signals into the semiconductor component. The coupling element and the waveguide form a plug contact. In the case of appropriate design of the plug contact there results upon plug-in a self-centering, so that need for a complex adjustment during manufacturing is absent. Since radar frequencies of above 100 GHz can be produced by the semiconductor component, corresponding fill level measuring devices are characterized by a high measuring resolution and compact structures.

Abstract: An optical assembly includes a lens unit capable of being moved along an optical axis of the optical assembly. The lens unit includes a lens mount for holding at least one lens. The optical assembly further includes a sleeve for receiving the lens mount. The lens mount is in sliding contact with and movable in relation to the sleeve as the lens unit is moved along the optical axis. The lens mount is formed of or comprises at its outer surface a self-lubricating material, and/or the sleeve is formed of or comprises at its inner surface a self-lubricating material.

Abstract: A high-frequency component for radar-based distance measurement comprises: a semiconductor component configured to generate electrical high-frequency signals; and coupling element configured as a substrate-integrated waveguide and electrically contacted by the semiconductor component as to couple the high-frequency signals as radar signals into a hollow waveguide of the high-frequency component, the hollow waveguide being in galvanic contact with the coupling element such that no defined distance between the hollow waveguide and the coupling element must be set to achieve an efficient coupling out of the high-frequency signal into the hollow waveguide. The galvanic contact thereby enables a simple manufacture of the high-frequency component and a compact and accurate distance measuring device using the high-frequency component.

Abstract: A radar based, fill-level sensor comprising at least one semiconductor element, including at least a semiconductor chip and a chip package, in which the at least one semiconductor chip is arranged, wherein the at least one semiconductor chip has at least one coupling element, which serves as a signal gate for electromagnetic waves, preferably in the millimeter wave region, characterized in that at least one first resonator structure is arranged on a surface portion of the chip package.

Abstract: The present disclosure relates to an electronic component for the bunched emitting and/or receiving of radar signals. For this, the electronic component comprises: a semiconductor chip, which is embodied to emit and/or to receive the radar signal by means of a primary radiator, and a support, on whose surface the semiconductor chip is arranged for electrical contacting. According to the present disclosure, the surface of the support has at least a first step embodied in such a manner that the radar signal in the case of the emitting and/or receiving is bunched approximately perpendicularly to the surface of the support. In this way, the electronic component-of the present disclosure is suited especially for those applications of radar based distance measurement, which benefit from bunched emitted and received radar signals.

Abstract: Disclosed is a high frequency module for producing or processing radar signals for use in radar-based fill-level measuring devices. The high frequency module includes: a semiconductor component to produce or to process electrical, high frequency signals; a dielectric coupling element contacted with the semiconductor component to couple the high frequency signals as radar signals into a dielectric waveguide or in order to couple radar signals from the waveguide as electrical, high frequency signals into the semiconductor component. The coupling element and the waveguide form a plug contact. In the case of appropriate design of the plug contact there results upon plug-in a self-centering, so that need for a complex adjustment during manufacturing is absent. Since radar frequencies of above 100 GHz can be produced by the semiconductor component, corresponding fill level measuring devices are characterized by a high measuring resolution and compact structures.

Abstract: A high-frequency component for radar-based distance measurement comprises: a semiconductor component configured to generate electrical high-frequency signals; and coupling element configured as a substrate-integrated waveguide and electrically contacted by the semiconductor component as to couple the high-frequency signals as radar signals into a hollow waveguide of the high-frequency component, the hollow waveguide being in galvanic contact with the coupling element such that no defined distance between the hollow waveguide and the coupling element must be set to achieve an efficient coupling out of the high-frequency signal into the hollow waveguide. The galvanic contact thereby enables a simple manufacture of the high-frequency component and a compact and accurate distance measuring device using the high-frequency component.

Abstract: A radar based, fill-level sensor comprising at least one semiconductor element, including at least a semiconductor chip and a chip package, in which the at least one semiconductor chip is arranged, wherein the at least one semiconductor chip has at least one coupling element, which serves as a signal gate for electromagnetic waves, preferably in the millimeter wave region, characterized in that at least one first resonator structure is arranged on a surface portion of the chip package.

Abstract: The present disclosure relates to an electronic component for the bunched emitting and/or receiving of radar signals. For this, the electronic component comprises: a semiconductor chip, which is embodied to emit and/or to receive the radar signal by means of a primary radiator, and a support, on whose surface the semiconductor chip is arranged for electrical contacting. According to the present disclosure, the surface of the support has at least a first step embodied in such a manner that the radar signal in the case of the emitting and/or receiving is bunched approximately perpendicularly to the surface of the support. In this way, the electronic component-of the present disclosure is suited especially for those applications of radar based distance measurement, which benefit from bunched emitted and received radar signals.

Abstract: A frequency generator includes two voltage controlled oscillators, which have a plurality of switchable sub-bands, each, and which are designed to produce respective frequency signals, wherein a switching from one sub-band to a neighboring sub-band occurs at predetermined switching locations. The sub-bands of the second oscillator are arranged offset in frequency relative to the sub-bands of the first oscillator. The frequency generator includes an electronic switch element, which is designed to switch either the first or the second frequency signal through to the output of the electronic switch element, and to switch the switch element such that during the producing of the frequency ramp alternately either the first or the second frequency signal is switched through to the output. When at one of the oscillators the switching between two neighboring sub-bands is occurring, the frequency signal produced by the other oscillator is switched through to the output.

Abstract: The invention relates to a method for producing a sound and/or thermal insulation element using foamable and/or prefoamed polymer particles which are coated with a binding agent, and preferably with an organic binding agent, and thereafter are subjected to a shaping process during which the polymer particles are bonded and/or sintered to one another, the bonding being caused by way of the binding agent. According to the invention, a non-hydrophilic binding agent is used for coating the foamable and/or prefoamed polymer particles. The invention furthermore relates to a sound and/or thermal insulation element.

Abstract: Described is a frequency generator for producing a frequency ramp. The frequency generator includes a first voltage controlled oscillator, which has a plurality of switchable sub-bands and is designed to produce a first frequency signal, wherein a switching from one sub-band to a neighboring sub-band occurs at predetermined first switching locations, as well as a second voltage controlled oscillator, which has a plurality of switchable sub-bands and is designed to produce a second frequency signal. A switching from one sub-band to a neighboring sub-band occurs at predetermined second switching locations. The sub-bands of the second voltage controlled oscillator are arranged offset in frequency relative to the sub-bands of the first voltage controlled oscillator.

Abstract: Method for manufacturing an insulation and drainage panel using foamable and/or pre-foamed polystyrene particles and an organic binder. The foamable and/or pre-foamed polystyrene particles are coated with the organic binder, filled into a mold and subjected to a final foaming process, wherein the foamable and/or pre-foamed polystyrene particles are coated using a powdery organic binder activated via the addition of moisture and/or heat, thereby forming a binder film that at least partially encases the polystyrene particles, which diminishes the expansion of the polystyrene particles during the final foaming process. The invention further relates to an insulation and drainage panel.

Abstract: A method for producing a multilayer molded body for the heat insulation of buildings, for which foamable or pre-foamed polymer particles for forming a layer are used. The foamable or pre-foamed polymer particles are at least partially coated with an organic binding agent, and are bonded in a mold having at least one plate made of expanded or extruded polystyrene rigid foam for carrying out a final foaming process. The invention furthermore relates to a multilayer molded body for the heat insulation of buildings.

Abstract: The present invention describes the use in epoxy resin compositions of semicarbazones of the general formula (I) having the meanings stated for the residues R1, R2, R3 and R4. These semicarbazones exhibit elevated latency in epoxy resin compositions and are thus outstandingly suitable as latent curing accelerators for single-component epoxy resin compositions.

Abstract: The present invention describes the use in epoxy resin compositions of semicarbazones of the general formula (I) having the meanings stated for the residues R1, R2, R3 and R4. These semicarbazones exhibit elevated latency in epoxy resin compositions and are thus outstandingly suitable as latent curing accelerators for single-component epoxy resin compositions.

Abstract: The present invention describes guanidine derivatives of the general formula (I) having the stated meanings for the residues R1, R2 and R3 as accelerators for cold-curing epoxy resin compositions. The curing of cold-curing epoxy resin systems may advantageously be accelerated with the assistance of these compounds.

Abstract: The invention pertains to a method for manufacturing a formed body with a cavity structure for the sound and/or heat insulation of buildings. According to the invention, pre-foamed polystyrene particles are compressed into a formed body in a mold or on a conveyor belt system under the influence of heat and/or pressure, wherein the degree of compression amounts to 0.2-0.8, preferably 0.3 to 0.7, particularly 0.4 to 0.6, such that a communicating cavity volume is preserved in the formed body. The invention furthermore pertains to a formed body for the sound and/or heat insulation of buildings.

Abstract: A formed body with a cavity structure for the sound and/or heat insulation of buildings. The formed body has a cavity structure and has pre-foamed polystyrene particles compressed in a mould or on a conveyor belt system under the influence of pressure and/or heat. The formed body has a communicating cavity volume and the communicating cavity volume has a volume fraction that amounts to 5 to 30 vol. %, preferably 10 to 25 vol. %, particularly 15 to 20 vol. %, referred to the total volume of the formed body, and comprising at least part of the pre-foamed polystyrene particles firmly enclosed in a cured organic or inorganic binder that is used for coating at least part of the polystyrene particles prior to their compression in a mould or on a conveyor belt system.

Abstract: The present invention describes the use in epoxy resin compositions of semicarbazones of the general formula (I) having the meanings stated for the residues R1, R2, R3 and R4. These semicarbazones exhibit elevated latency in epoxy resin compositions and are thus outstandingly suitable as latent curing accelerators for single-component epoxy resin compositions.