Abstract: Techniques are disclosed for reducing impact of a repair action in a switch fabric. In one embodiment, a server system is provided that includes a first interposer card that operatively connects one or more server cards to a midplane. The first interposer card may include a switch module that switches network traffic for the one or more server cards. The first interposer card may be hot-swappable from the midplane, and the one or more server cards may be hot-swappable from the first interposer card.

Abstract: Techniques are disclosed for reducing impact of a switch failure and/or a repair action in a switch fabric. In one embodiment, a server system is provided that includes a first interposer card that operatively connects one or more server cards to a midplane. The first interposer card may include a switch module that switches network traffic for the one or more server cards. The first interposer card may be hot-swappable from the midplane, and the one or more server cards may be hot-swappable from the first interposer card. The server system may further include an interconnect between the first interposer card and a second interposer card.

Abstract: Techniques are disclosed for reducing impact of a switch failure in a switch fabric. In one embodiment, a server system is provided that includes a midplane, one or more server cards and one or more switch cards. The midplane may include a fabric interconnect for a switch fabric. The one or more server cards may be coupled with the midplane, where each server card is hot-swappable from the midplane. The one or more switch cards may also be coupled with the midplane, where each switch card is also hot-swappable from the midplane. Each switch card includes one or more switch modules, and each switch module is configured to switch network traffic for at least one server card.

Abstract: One embodiment includes the provision of a novel insert-and-rotate connection for a daughter card, such as in a blade computer system. The daughter card has both a card edge with a plurality of card edge contacts and a mezzanine connector spaced from the card edge. An interposer mounted on the motherboard has a card edge connector and a midplane connector in communication with the card edge connector. The card edge connector includes a socket for receiving the card edge of the daughter card with the daughter card at an acute angle to the motherboard, to avoid interference between the mezzanine connector on the daughter card and a corresponding mezzanine connector on the motherboard. Once the card edge is inserted into the socket of the card edge connector, the socket allows for rotation of the daughter card about the received card edge. The mezzanine connectors are aligned for connection in response to rotation of the daughter card about the received card edge.

Abstract: One embodiment includes the provision of a novel insert-and-rotate connection for a daughter card, such as in a blade computer system. The daughter card has both a card edge with a plurality of card edge contacts and a mezzanine connector spaced from the card edge. An interposer mounted on the motherboard has a card edge connector and a midplane connector in communication with the card edge connector. The card edge connector includes a socket for receiving the card edge of the daughter card with the daughter card at an acute angle to the motherboard, to avoid interference between the mezzanine connector on the daughter card and a corresponding mezzanine connector on the motherboard. Once the card edge is inserted into the socket of the card edge connector, the socket allows for rotation of the daughter card about the received card edge. The mezzanine connectors are aligned for connection in response to rotation of the daughter card about the received card edge.

Abstract: A scalability card for use with a plurality of computer blades. The computer blades are releasably securable in a parallel configuration, wherein each blade includes a circuit board and a processor operatively coupled to the circuit board. Each processor is in electronic communication with a scalability connector on a floating plate that is loosely secured to the computer blade. Furthermore, each scalability connector is preferably disposed in a common plane extending perpendicular to the plurality of parallel computer blades. The scalability card includes a plurality of electronically interconnected scalability connectors arranged for rough alignment with the scalability connectors of each computer blade. In addition, the scalability card preferably includes at least one alignment feature for engaging each floating plate and, therefore, providing fine alignment of the scalability connector on each floating plate to one of the scalability connectors of the scalability card.

Abstract: Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

Abstract: Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

Abstract: A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a memory module system and DIMM connector is provided. A DIMM connector includes a plurality of DIMM sockets for receiving a corresponding plurality of DIMMs in a radially oriented, angularly spaced orientation. The DIMM sockets are connected in parallel at a memory module junction so that socket terminals of each DIMM socket are joined to the same relative terminal of all the other DIMM sockets along electronic pathways of substantially equal length. A memory controller selectively communicates with the DIMMs via the DIMM junction. By virtue of the improved topology, impedance within the DIMM connector may be better matched to minimize reflections and improve signal quality.

Abstract: A computer system includes a plurality of subsystems cooled by a cooling flow; at least one redirection device, a management module, and a blower for generating the cooling flow. The redirection device is associated with at least one subsystem and operable to redirect at least a portion of the cooling flow away from the subsystem. The subsystems, the at least one redirection device, and the blower are disposed along a common cooling flow path. The management module is configured to determine cooling requirements of the subsystems and to control the operation of the blower and the at least one redirection device to maintain a specified amount of cooling to the subsystems and to reduce acoustical noise generated by the blower.

Abstract: A computer system includes a plurality of blade servers, a midplane, a supplemental midplane, and a peripheral device separate from the blade servers. The midplane includes a plurality of connectors connecting the midplane to the plurality of blade servers. The supplemental midplane is separate from the midplane and includes a body, a plurality of connectors, and a peripheral connector. The plurality of connectors are attached to the body and connect the supplemental midplane to the plurality of blade servers. The peripheral connector is attached to the body and connects the supplemental midplane to the peripheral device. The plurality of connectors of the supplemental midplane communicate with the peripheral connector of the supplemental midplane. The plurality of connectors of the supplemental midplane are configured to be removably connectable to the midplane.

Abstract: A method and system for packaging a computer system is disclosed. The computer system is capable of including a plurality of blades, a first plurality of devices, and a second plurality of devices. The method and system include providing a chassis having a first cavity, a first plenum, a second plenum and a common plenum therein. The first cavity retains the blades in parallel. The chassis is configured such that air sufficient to cool the blades is drawn into the chassis and through the blades. The first plenum is configured such that a first portion of the air sufficient to cool the first plurality of devices is drawn from the blades into the first plenum, through the first plurality of devices and into the common plenum. The second plenum is configured in an analogous manner for the second plurality of devices.

Abstract: A method and system for packaging a computer system is disclosed. The computer system is capable of including a plurality of blades, a first plurality of devices, and a second plurality of devices. The method and system include providing a chassis having a first cavity, a first plenum, a second plenum and a common plenum therein. The first cavity retains the blades in parallel. The chassis is configured such that air sufficient to cool the blades is drawn into the chassis and through the blades. The first plenum is configured such that a first portion of the air sufficient to cool the first plurality of devices is drawn from the blades into the first plenum, through the first plurality of devices and into the common plenum. The second plenum is configured in an analogous manner for the second plurality of devices.