Abstract: The invention provides an apparatus, system, and method for enabling the installation of an installable device configured with a required component in a receiving device. A component deactivated interlock obstructs the installation of the installable device when not configured with the required component. The invention makes use of an extendable and retractable plunger disposed upon the installable device, a stop barrier disposed upon the receiving device, and an actuator disposed upon the required component. The plunger normally extends beyond the installable device, and upon contacting the stop barrier of the receiving device obstructs the installation. Upon a physical connection of the required component with the installable device, the actuator retracts the plunger, thereby enabling the installation of the installable device.

Abstract: Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.

Abstract: Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependent upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify an upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.

Abstract: The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Abstract: The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Abstract: The functionality of a blade is expanded by the installation of an expansion unit including expansion components. The blade and expansion unit are provided with connectors allowing the blade components to access and utilize the expansion components when the connectors are mated. The blade and expansion unit include elements ensuring that the connectors align properly as the expansion unit is installed onto the blade, making the installation simple and quick. The blade and expansion unit also include elements securing the connection between the two, once made.

Abstract: The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Abstract: A server blade system includes a plurality of slots for receiving server blades. The system includes an air moving device to move air through each of the server blades installed in the system. When one of the server blades is removed, a bypass damper rotates into the empty slot to obstruct the flow of air through the slot. The bypass damper is pivotally mounted within each slot and includes a torsion spring to move the damper into the obstruction position. Two hinge pin mounts, which are “U” shaped in cross section, provide a snap fit for two hinge pins positioned at one end of the bypass damper. A spring mounting pin is positioned between the two hinge pins and a torsion spring is mounted over the spring mounting pin.

Abstract: A server blade system includes a plurality of slots for receiving server blades. The system includes an air moving device to move air through each of the server blades installed in the system. When one of the server blades is removed, a bypass damper rotates into the empty slot to obstruct the flow of air through the slot. The bypass damper is pivotally mounted within each slot and includes a torsion spring to move the damper into the obstruction position. Two hinge pin mounts, which are “U” shaped in cross section, provide a snap fit for two hinge pins positioned at one end of the bypass damper. A spring mounting pin is positioned between the two hinge pins and a torsion spring is mounted over the spring mounting pin.

Abstract: The functionality of a blade is expanded by the installation of an expansion unit including expansion components. The blade and expansion unit are provided with connectors allowing the blade components to access and utilize the expansion components when the connectors are mated. The blade and expansion unit include elements ensuring that the connectors align properly as the expansion unit is installed onto the blade, making the installation simple and quick. The blade and expansion unit also include elements securing the connection between the two, once made.

Abstract: The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Abstract: An air moving system such as a fan or blower system includes a back flow damper that functions in two orientations; non-inverted and inverted. First and second “end” baffles are pivotally attached at opposite ends of the damper, and three “middle” baffles are pivotally attached between the two end baffles. When the air moving system fails in the non-inverted orientation, the first end baffle and the three middle baffles are gravity operated to close off the air outlet to prevent the back flow of air, and the second end baffle pivots away from the outlet. When the air moving device fails in the inverted orientation, the second end baffle and the three middle baffles operate to close off the air outlet, and the first end baffle pivots away from the outlet. The three middle baffles are pivotally coupled to a connecting rod, which prevents the inadvertent jamming of baffles.

Abstract: A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.