Abstract: A method for generating a layout, use of a transistor layout, and semiconductor circuit is provided that includes a matching structure, which has a number of transistors, whose structure is similar to one another, metallization levels with geometrically formed traces, which are formed directly above the transistors, and vias (in via levels), which are formed between two of the metallization levels. Whereby, within one and the same metallization level, the geometry of the traces above each transistor is formed the same.

Abstract: A device for fastening an electronic module on a mounting rail and an electronic module fastened with the device on a mounting rail are provided. The device has a displaceable nose, encompassing a profile of the mounting rail together with a stationary nose provided on the back of a housing of the electronic module. The displaceable nose is configured as a clamping profile of a slide. By plugging in mechanical anchorings, the device is mounted in recesses of the housing on the back of the electronic module. The device has a spring mechanism provided to support the electronic module on the housing. A clamping force of the device on the mounting rail results from a force to the slide applied by the spring mechanism. An end of the slide opposite of the displaceable nose protrudes beyond the housing of the electronic module for the manual displacement of the displaceable nose.

Abstract: An integrated amplifier circuit is provided with an amplifier that is composed of at least two amplifier regions, the amplifier regions being arranged about a symmetry point, wherein each amplifier region has a plurality of transistors in a transistor region, and wherein transistors from different amplifier areas are arranged within the same transistor region. According to an aspect, provision is made that each amplifier region has at least two transistors.

Abstract: A method for generating a layout, use of a transistor layout, and semiconductor circuit is provided that includes a matching structure, which has a number of transistors, whose structure is similar to one another, metallization levels with geometrically formed traces, which are formed directly above the transistors, and vias (in via levels), which are formed between two of the metallization levels. Whereby, within one and the same metallization level, the geometry of the traces above each transistor is formed the same.

Abstract: A packaging for at least two constituents has a tubular or bag-shaped packaging element (1.1, 3.1, 4.1, 5.1, 6.1, 7.1, 8.1, 9.1) and an applicator (1.2, 2.2, 3.2, 4.2, 5.2, 6.2, 7.2, 8.2, 9.2) having a dispensing channel for the mixed constituents and being connectable to the packaging element, wherein the packaging element is designed for storing at least one constituent and for mixing the at least two constituents. This makes it possible to create a packaging for two or a plurality of constituents that can be mixed together and applied in a simple manner in a metered administration. In a preferred embodiment of the invention the two constituents (or a plurality of constituents) are accommodated jointly in a single flexible (tubular or bag-like) packaging, which also serves as a mixing chamber, whereas the applicator only fulfills its function as an application aid.