Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.

Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.

Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.

Abstract: An electromagnetic interference shield for use around access panels and doors in electronic equipment enclosures includes a base and profile manufactured from an electrically nonconductive solid material such as a thermoplastic resin polymer. An electrically conductive layer of a metallized fabric is bonded to the profile to provide effective shielding and grounding functions. The underlying polymer provides elastic compliancy and resiliency to the shield. The shield may be divided into flexible fingers which can be rectangular or nonlinear shaped. The nonlinear shaped flexible fingers form nonlinear shaped slits between the fingers which provides improved EMI shielding by reducing the amount of EMI transmission that can pass through the shield. The electromagnetic interference shield may also be made from an electrically conductive material.

Abstract: An electromagnetic interference shield for use around access panels and doors in electronic equipment enclosures includes a base and profile manufactured from an electrically nonconductive solid material such as a thermoplastic resin polymer. An electrically conductive layer of a metallized fabric is bonded to the profile to provide effective shielding and grounding function. The underlying polymer provides elastic compliancy and resiliency to the shield. The shield may be divided into flexible fingers which can be rectangular or nonlinear shaped. The nonlinear shaped flexible finger from nonlinear shaped slits between the fingers which provides improved EMI shielding by reducing the amount of EMI transmission that can pass through the shield. The electromagnetic interference shield may also be made from an electrically conductive material.

Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use around access panels and doors in electronic equipment enclosures and elsewhere. The shields may include an electrically nonconductive substrate in combination with an electrically conductive element. In one embodiment, the method may use vapor deposition, plating, or painting techniques for depositing a conductive layer on the substrate surface. In another embodiment the method may use foam-forming to intersperse conductive elements within the substrate. The conductive layer and conductive elements provide effective shielding and grounding functions, and the substrate provides elastic compliancy and resiliency to the shield.

Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.

Abstract: A process and an apparatus for treating waste water in oxidations ponds, oxidation ditches, or other bodies of water in a waste water treatment facility to abate the malodors caused by the presence of volatile contaminants. In the process, a water stream is withdrawn from the body of waste water and contacted with an air stream in an air-water contact apparatus. The water stream is thereby aerated and stripped of potentially odor causing volatile contaminants and an off-gas stream is produced containing the stripped volatile contaminants. At least a portion of the aerated and stripped water stream is returned to the body of waste water to inhibit anaerobic decomposition of organic impurities.

Abstract: A process and an apparatus for treating waste water in oxidations ponds, oxidation ditches, or other bodies of water in a waste water treatment facility to abate the malodors caused by the presence of volatile contaminants. In the process, a water stream is withdrawn from the body of waste water and contacted with an air stream in an air-water contact apparatus. The water stream is thereby aerated and stripped of potentially odor causing volatile contaminants and an off-gas stream is produced containing the stripped volatile contaminants. At least a portion of the aerated and stripped water stream is returned to the body of waste water to inhibit anaerobic decomposition of organic impurities.

Abstract: A solid state pH sensor having an indicator electrode of metal/metal oxide and a reference electrode of metal/metal salt applied to inert, electrical conductors imbedded in an electrically non-conductive substrate, such as a ceramic substrate. The sensing portion of the sensor preferably has a coating of an annealed perfluorocarbon copolymer. Alternatively, the indicator or reference electrodes may be formed on separate electrically non-conductive substrates with each having an inert electrical conductor imbedded therein. These indicator or reference electrodes may be utilized with each other or with prior art electrodes.