Abstract: Methods of self-aligned multiple patterning. A hardmask is deposited over an interlayer dielectric layer. A mandrel is formed over the hardmask. A block mask is formed that covers a first lengthwise section of the mandrel and that exposes second and third lengthwise sections of the mandrel. After forming the block mask, the second and third lengthwise sections of the mandrel are removed to define a pattern including respective first and second mandrel lines that are separated from each other by the first lengthwise section of the mandrel. The first mandrel line and the second mandrel line expose respective portions of the hardmask, and the first lengthwise section of the mandrel line covers another portion of the hardmask. The pattern is transferred to the hardmask with an etching process, and subsequently transferred to the interlayer dielectric layer with another etching process.

Abstract: Example embodiments relate to methods for forming via holes self-aligned with metal blocks on substrates. One embodiment includes a method where the substrate includes an interlayer dielectric layer. The method includes forming a metallic layer on the interlayer dielectric layer. The method also includes forming a dielectric layer on the metallic layer and forming a plurality of parallel spacer line structures on the dielectric layer. In addition, the method includes forming a sidewall oxide, a first sacrificial layer, and an opening in the first sacrificial layer. Further, the method includes etching the dielectric layer and removing the first sacrificial layer. Additionally, the method includes forming a second sacrificial layer, forming an opening in the second sacrificial layer, depositing a metal block on the metallic layer, and removing the second sacrificial layer. Still further, the method includes etching the metallic layer and the interlayer dielectric layer to form a via hole.

Abstract: A method is provided for producing electrically conductive lines (23a, 23b), wherein spacers are deposited on a sacrificial structure present on a stack of layers, including a hardmask layer on top of a dielectric layer into which the lines are to be embedded, and an intermediate layer on top of the hardmask layer. A self-aligned litho-etch step is then performed to create an opening in the intermediate layer, the opening being self-aligned to the space between two adjacent sidewalls of the sacrificial structure. This self-aligned step precedes the deposition of spacers on the sacrificial structure, so that spacers are also formed on the transverse sidewalls of the opening, i.e. perpendicular to the spacers on the walls of the sacrificial structure. A blocking material is provided in the area of the bottom of the opening that is surrounded on all sides by spacers, thereby creating a block with a reduced size.

Abstract: Immunosensors according to present embodiments combine a sandwich bioassay with an electrochemical surface plasmon resonance device for electrochemical detection of analytes from a sample, whereby a coated substrate for receiving an electroactive probe may be located in a flow cell, and the coated substrate comprises a first layer which is a silver (Ag) layer and a second layer which is a gold (Au) layer arranged so that the gold layer isolates the silver layer from an operating environment.

Abstract: A method is provided for producing electrically conductive lines (23a, 23b), wherein spacers are deposited on a sacrificial structure present on a stack of layers, including a hardmask layer on top of a dielectric layer into which the lines are to be embedded, and an intermediate layer on top of the hardmask layer. A self-aligned litho-etch step is then performed to create an opening in the intermediate layer, the opening being self-aligned to the space between two adjacent sidewalls of the sacrificial structure. This self-aligned step precedes the deposition of spacers on the sacrificial structure, so that spacers are also formed on the transverse sidewalls of the opening, i.e. perpendicular to the spacers on the walls of the sacrificial structure. A blocking material is provided in the area of the bottom of the opening that is surrounded on all sides by spacers, thereby creating a block with a reduced size.

Abstract: Example embodiments relate to methods for forming via holes self-aligned with metal blocks on substrates. One embodiment includes a method where the substrate includes an interlayer dielectric layer. The method includes forming a metallic layer on the interlayer dielectric layer. The method also includes forming a dielectric layer on the metallic layer and forming a plurality of parallel spacer line structures on the dielectric layer. In addition, the method includes forming a sidewall oxide, a first sacrificial layer, and an opening in the first sacrificial layer. Further, the method includes etching the dielectric layer and removing the first sacrificial layer. Additionally, the method includes forming a second sacrificial layer, forming an opening in the second sacrificial layer, depositing a metal block on the metallic layer, and removing the second sacrificial layer. Still further, the method includes etching the metallic layer and the interlayer dielectric layer to form a via hole.

Abstract: Methods of self-aligned multiple patterning. First and second mandrels are formed over a hardmask, and a conformal spacer layer is deposited over the first mandrel, the second mandrel, and the hardmask between the first mandrel and the second mandrel. A planarizing layer is patterned to form first and second trenches that expose first and second lengthwise portions of the conformal spacer layer respectively between the first and second mandrels. After patterning the planarizing layer, the first and second lengthwise portions of the conformal spacer layer are removed with an etching process to expose respective portions of the hardmask along a non-mandrel line. A third lengthwise portion of the conformal spacer layer is masked during the etching process by a portion of the planarizing layer and defines a non-mandrel etch mask.

Abstract: Methods of self-aligned multiple patterning. A mandrel is formed over a hardmask, and a planarizing layer is formed over the mandrel and the hardmask. The planarizing layer is patterned to form first and second trenches exposing respective first and second lengthwise sections of the mandrel. A portion of the patterned planarizing layer covers a third lengthwise section of the mandrel arranged between the first and second lengthwise sections of the mandrel. After patterning the planarizing layer, the first and second lengthwise sections of the mandrel are removed with an etching process to define a pattern including a mandrel line exposing respective first portions of the hardmask. The third lengthwise section of the mandrel is masked by the portion of the planarizing layer during the etching process, and the third lengthwise section covers a second portion of the hardmask arranged along the mandrel line between the first portions of the hardmask.

Abstract: Methods of self-aligned multiple patterning. A mandrel is formed over a hardmask, and a planarizing layer is formed over the mandrel and the hardmask. The planarizing layer is patterned to form first and second trenches exposing respective first and second lengthwise sections of the mandrel. A portion of the patterned planarizing layer covers a third lengthwise section of the mandrel arranged between the first and second lengthwise sections of the mandrel. After patterning the planarizing layer, the first and second lengthwise sections of the mandrel are removed with an etching process to define a pattern including a mandrel line exposing respective first portions of the hardmask. The third lengthwise section of the mandrel is masked by the portion of the planarizing layer during the etching process, and the third lengthwise section covers a second portion of the hardmask arranged along the mandrel line between the first portions of the hardmask.

Abstract: Methods of self-aligned multiple patterning. First and second mandrels are formed over a hardmask, and a conformal spacer layer is deposited over the first mandrel, the second mandrel, and the hardmask between the first mandrel and the second mandrel. A planarizing layer is patterned to form first and second trenches that expose first and second lengthwise portions of the conformal spacer layer respectively between the first and second mandrels. After patterning the planarizing layer, the first and second lengthwise portions of the conformal spacer layer are removed with an etching process to expose respective portions of the hardmask along a non-mandrel line. A third lengthwise portion of the conformal spacer layer is masked during the etching process by a portion of the planarizing layer and defines a non-mandrel etch mask.

Abstract: Methods of self-aligned multiple patterning. A hardmask is deposited over an interlayer dielectric layer. A mandrel is formed over the hardmask. A block mask is formed that covers a first lengthwise section of the mandrel and that exposes second and third lengthwise sections of the mandrel. After forming the block mask, the second and third lengthwise sections of the mandrel are removed to define a pattern including respective first and second mandrel lines that are separated from each other by the first lengthwise section of the mandrel. The first mandrel line and the second mandrel line expose respective portions of the hardmask, and the first lengthwise section of the mandrel line covers another portion of the hardmask. The pattern is transferred to the hardmask with an etching process, and subsequently transferred to the interlayer dielectric layer with another etching process.

Abstract: Immunosensors according to present embodiments combine a sandwich bioassay with an electro-active, integrated optical waveguide (EA-IOW) for the detection of infectious pathogens and other analytes from a sample, whereby the electro-active waveguide surface is functionalized with a capture antibody capable of specific binding with a particular antigen. This functionalized arrangement then promotes the binding of a secondary, labeled antibody serving as a redox probe, which produces an analytical signal having unique spectral and electrochemical properties for the detection of virus antigens, pathogens, and other analytes that bind to proteins.

Abstract: One or more techniques and/or systems are provided for service notification. A notification component may be associated with a hygiene device, such as a material dispenser. The notification component may receive a service notification request (e.g., an infrared signal or other wireless signal) from a maintenance management device (e.g., a computing device associated with a maintenance cart or mobile device of a housekeeper) based upon the maintenance management device being within a communication threshold distance of the hygiene device. The notification component may evaluate a current operational status of the hygiene device to determine a service notification to provide (e.g., a low battery alert, a refill container level indicator, etc.). The service notification may be provided through the hygiene device or through the maintenance management device to the housekeeper (e.g., a blinking light, an audible notification, a textual notification, etc.).

Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

Abstract: One or more techniques and/or systems are provided for service notification. A notification component may be associated with a hygiene device, such as a material dispenser. The notification component may receive a service notification request (e.g., an infrared signal or other wireless signal) from a maintenance management device (e.g., a computing device associated with a maintenance cart or mobile device of a housekeeper) based upon the maintenance management device being within a communication threshold distance of the hygiene device. The notification component may evaluate a current operational status of the hygiene device to determine a service notification to provide (e.g., a low battery alert, a refill container level indicator, etc.). The service notification may be provided through the hygiene device or through the maintenance management device to the housekeeper (e.g., a blinking light, an audible notification, a textual notification, etc.).

Abstract: When forming sophisticated semiconductor devices including metal pillars arranged on contact pads, which may comprise aluminum, device performance and reliability may be improved by avoiding exposure of the contact pad material to the ambient atmosphere, in particular during and between dicing and packaging processes. To this end, the contact pad material may be covered by a protection layer or may be protected by the metal pillars itself, thereby concurrently improving mechanical stress distribution in the device.

Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

Abstract: TurbinAL™ is a high-flow carbon dioxide system providing continuous, pressure and temperature regulated gas supply of carbon dioxide for turbine system purging. In a preferred embodiment, the TurbinAL™ system has: a) Four or more dip-tube equipped carbon dioxide cylinder six- or sixteen-packs with integral check valves, flow restriction orifices, and single outlet manifolds; b) Two flow manifolds which are connected to the packs with flexible gas safety lines; c) A transducer controlled automatic switchover manifold that switches gas flow from one flow manifold to the other with no interruption in gas flow; d) An electric heater system designed to vaporize liquid carbon dioxide drawn from a cylinder (via the dip tube) to be supplied to the turbines as a temperature controlled gas; e) A programmable logic controller (PLC) to automatically control and monitor system functions; and f) A flow control device to prevent excess flow to the turbine(s).

Abstract: When forming sophisticated semiconductor devices including metal pillars arranged on contact pads, which may comprise aluminum, device performance and reliability may be improved by avoiding exposure of the contact pad material to the ambient atmosphere, in particular during and between dicing and packaging processes. To this end, the contact pad material may be covered by a protection layer or may be protected by the metal pillars itself, thereby concurrently improving mechanical stress distribution in the device.

Abstract: TurbinAL™ is a high-flow carbon dioxide system providing continuous, pressure and temperature regulated gas supply of carbon dioxide for turbine system purging. In a preferred embodiment, the TurbinAL™ system has: a) Four or more dip-tube equipped carbon dioxide cylinder six- or sixteen-packs with integral check valves, flow restriction orifices, and single outlet manifolds; b) Two flow manifolds which are connected to the packs with flexible gas safety lines; c) A transducer controlled automatic switchover manifold that switches gas flow from one flow manifold to the other with no interruption in gas flow; d) An electric heater system designed to vaporize liquid carbon dioxide drawn from a cylinder (via the dip tube) to be supplied to the turbines as a temperature controlled gas; e) A programmable logic controller (PLC) to automatically control and monitor system functions; and f) A flow control device to prevent excess flow to the turbine(s).